Inventor
SCOTT M. HAYES
Inventor
US
Overview
Patents· 26 as inventor
Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.
H10Wprimary
H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h1029%
H01LSemiconductor devices26%
H01QAntennas, i.e. radio aerials11%
H10PGeneric processes or apparatus for the manufacture or treatment of devices covered by class h1010%
H05KPrinted circuits5%
B81BMicrostructural devices or systems, e.g. micromechanical devices4%
B81CProcesses or apparatus specially adapted for the manufacture or treatment of microstructural devices or systems4%
G01LMeasuring force, stress, torque, work, mechanical power, mechanical efficiency, or fluid pressure4%
H01PWaveguides3%
H01RElectrically-conductive connections3%
PatentTitleYear
12,599,004Semiconductor device with active mold package and method therefor202612,589,990Die stacking with controlled tilt and angular alignment202612,588,557Multichip packages with 3D integration202612,588,517Semiconductor device with self-aligned waveguide and method therefor202612,538,844Double-sided multichip packages202612,469,773Semiconductor device with attached battery and method therefor202512,406,896Semiconductor device package having thermal dissipation feature and method therefor202512,381,164Semiconductor device with enclosed cavity and method therefor202512,288,766Semiconductor device with open cavity and method therefor202512,243,842Semiconductor device with open cavity and method therefor202512,125,716Semiconductor device packaging warpage control202412,119,316Patterned and planarized under-bump metallization202412,033,950Semiconductor device with self-aligned waveguide and method therefor202411,961,776Semiconductor device with connector in package and method therefor202411,935,809Semiconductor package thermal spreader having integrated EF/EMI shielding and antenna elements202411,837,560Semiconductor device with waveguide and method therefor202311,823,968Semiconductor device package having stress isolation and method therefor202311,817,366Semiconductor device package having thermal dissipation feature and method therefor202311,791,283Semiconductor device packaging warpage control202311,760,623No-gel pressure sensor package202311,728,285Semiconductor device packaging warpage control202311,557,544Semiconductor device having a translation feature and method therefor202311,557,525Semiconductor package thermal spreader having integrated RF/EMI shielding and antenna elements202311,498,829No-gel pressure sensor package202211,404,288Semiconductor device packaging warpage control202211,335,652Method, system, and apparatus for forming three-dimensional semiconductor device package with waveguide2022Career & activity timeline
Assembled from patent assignee/location history and declaration credentials.
2022–2026Patents assigned to NXP USA INC (25)· patent assignee history
2022–2026Based in US· patent location history
2026Patents assigned to ST MICROELECTRONICS INT NV (1)· patent assignee history
Inventor activity
Assignee and location history derived from the patent record.
Assignees
| Assignee | Patents | Span |
|---|---|---|
| NXP USA INC | 25 | 2022–2026 |
| ST MICROELECTRONICS INT NV | 1 | 2026 |
Locations
| Location | Patents | Span |
|---|---|---|
| US | 26 | 2022–2026 |