Inventor
Philip H. Bowles
Inventor
Gilbert, AZ, US
Overview
Patents· 29 as inventor
Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.
H10Wprimary
H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h1025%
B81BMicrostructural devices or systems, e.g. micromechanical devices20%
B81CProcesses or apparatus specially adapted for the manufacture or treatment of microstructural devices or systems20%
H01LSemiconductor devices11%
Y10TTechnical subjects covered by former us classification4%
H01CResistors3%
H05KPrinted circuits3%
H10DInorganic electric semiconductor devices3%
B60CVehicle tyres1%
C23CCoating metallic material1%
PatentTitleYear
10,442,685Microelectronic packages having hermetic cavities and methods for the production thereof201910,053,359Microelectronic packages having axially-partitioned hermetic cavities and methods for the fabrication thereof20189,891,244'Microelectronic packages having split gyroscope structures and methods for the fabrication thereof'20189,676,611'Sensor device packages and related fabrication methods'20179,604,844'Sequential wafer bonding'20179,499,397'Microelectronic packages having axially-partitioned hermetic cavities and methods for the fabrication thereof'20169,376,310'Microelectronic packages having stacked accelerometer and magnetometer die and methods for the production thereof'20169,365,414'Sensor package having stacked die'20169,359,192'Microelectromechanical systems (MEMS) devices with control circuits and methods of fabrication'20169,227,838'Cavity-type semiconductor package and method of packaging same'20169,165,886'Sensor packaging method and sensor packages'20159,108,841'Microelectronic packages having stacked accelerometer and magnetometer die and methods for the production thereof'20159,090,454'Sequential wafer bonding'20159,040,355'Sensor package and method of forming same'20159,018,029'Vent hole sealing in multiple die sensor device'20158,962,389'Microelectronic packages including patterned die attach material and methods for the fabrication thereof'20158,906,747'Cavity-type semiconductor package and method of packaging same'20148,884,413'Leadframes, air-cavity packages, and electronic devices with offset vent holes, and methods of their manufacture'20148,709,868'Sensor packages and method of packaging dies of differing sizes'20148,686,550'Method and apparatus for high pressure sensor device'20148,659,167'Sensor packaging method and sensor packages'20147,723,224'Microelectronic assembly with back side metallization and method for forming the same'20107,446,017'Methods and apparatus for RF shielding in vertically-integrated semiconductor devices'20086,631,551'Method of forming integral passive electrical components on organic circuit board substrates'20036,233,817'Method of forming thick-film hybrid circuit on a metal circuit board'20016,180,164'Method of forming ruthenium-based thick-film resistors'20015,982,631'X-ray detectable encapsulation material and method for its use'19995,891,754'Method of inspecting integrated circuit solder joints with x-ray detectable encapsulant'19995,594,770'Method and apparatus for imaging obscured areas of a test object'1997Career & activity timeline
Assembled from patent assignee/location history and declaration credentials.
1997–2003Based in Carmel, IN, US· patent location history
1999–2001Patents assigned to DELCO ELECTRONICS CORP (3)· patent assignee history
2008–2018Patents assigned to FREESCALE SEMICONDUCTOR INC (19)· patent assignee history
2008–2015Based in Fountain Hills, AZ, US· patent location history
2014–2019Patents assigned to BOWLES PHILIP H (16)· patent assignee history
2014–2019Patents assigned to HOOPER STEPHEN R (14)· patent assignee history
2015–2019Based in Gilbert, AZ, US· patent location history
2016–2018Based in San Diego, CA, US· patent location history
2017–2019Patents assigned to NXP USA INC (5)· patent assignee history
Inventor activity
Assignee and location history derived from the patent record.
Assignees
| Assignee | Patents | Span |
|---|---|---|
| FREESCALE SEMICONDUCTOR INC | 19 | 2008–2018 |
| BOWLES PHILIP Hself | 16 | 2014–2019 |
| HOOPER STEPHEN R | 14 | 2014–2019 |
| NXP USA INC | 5 | 2017–2019 |
| DELCO ELECTRONICS CORP | 3 | 1999–2001 |
Locations
| Location | Patents | Span |
|---|---|---|
| Gilbert, AZ, US | 12 | 2015–2019 |
| Fountain Hills, AZ, US | 9 | 2008–2015 |
| Carmel, IN, US | 6 | 1997–2003 |
| San Diego, California, US | 2 | 2016–2018 |