Inventor

Terunao Hanaoka

Inventor

Suwa, JP

Overview

2003–2020

Patent span

Electricity

Primary field (CPC H)

Patents· 35 as inventor

Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.

H10Wprimary

H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h1041%

B81BMicrostructural devices or systems, e.g. micromechanical devices10%

G02BOptical elements, systems or apparatus10%

H10PGeneric processes or apparatus for the manufacture or treatment of devices covered by class h1010%

G03BApparatus or arrangements for taking photographs or for projecting or viewing them6%

H10DInorganic electric semiconductor devices5%

B81CProcesses or apparatus specially adapted for the manufacture or treatment of microstructural devices or systems3%

G01CMeasuring distances, levels or bearings3%

H01LSemiconductor devices3%

A61BDiagnosis2%

PatentTitleYear

10,859,814Electro-optical device, manufacturing method thereof, and electronic apparatus2020 10,156,779Electro-optical device, method of manufacturing electro-optical device, and electronic apparatus2018 10,054,787Electro-optical device, manufacturing method thereof, and electronic apparatus2018 9,885,945'Electro-optical device, method of manufacturing electro-optical device, and electronic apparatus'2018 9,748,115'Electronic component and method for producing the same'2017 9,709,800'Electro-optical device, manufacturing method thereof, and electronic apparatus'2017 9,465,210'Electro-optical device, method of manufacturing electro-optical device, and electronic apparatus'2016 9,443,993'Spectroscopic sensor and method for manufacturing same'2016 8,749,001'Electronic component, electronic device, and method of manufacturing the electronic component'2014 8,631,701'Sensor device, motion sensor, and electronic device'2014 7,714,410'Semiconductor device'2010 7,670,859'Semiconductor device and method for manufacturing the same'2010 7,605,464'Semiconductor device'2009 7,462,937'Semiconductor device'2008 7,459,637'Semiconductor device, manufacturing method thereof, circuit board, and electronic appliance'2008 7,294,933'Semiconductor wafer, semiconductor device and method of manufacturing the same, circuit board, and electronic equipment'2007 7,183,645'Semiconductor device with external terminal joined to concave portion of wiring layer'2007 7,176,572'Semiconductor wafer, semiconductor device and method of manufacturing the same, circuit board, and electronic equipment'2007 7,144,760'Semiconductor device, method of manufacturing the same, circuit board, and electronic equipment'2006 7,102,219'Semiconductor device, method of fabricating the same, stack-type semiconductor device, circuit board and electronic instrument'2006 7,067,929'Semiconductor wafer, semiconductor device, circuit board, electronic instrument, and method for manufacturing semiconductor device'2006 7,057,282'Semiconductor device and method for manufacturing the same, circuit board and electronic equipment'2006 7,009,306'Semiconductor device and method of manufacturing the same, circuit board, together with electronic instrument'2006 6,962,865'Semiconductor device, method of fabricating the same, stack-type semiconductor device, circuit board and electronic instrument'2005 6,958,527'Wiring board having interconnect pattern with land, and semiconductor device, circuit board, and electronic equipment incorporating the same'2005 6,940,160'Semiconductor device and method of manufacture thereof, circuit board, and electronic instrument'2005 6,924,558'Semiconductor device and method of fabricating the same, circuit board, and electronic instrument'2005 6,897,127'Semiconductor device, method of manufacturing the same, circuit board, and electronic instrument'2005 6,894,394'Semiconductor device, circuit board, electronic apparatus, and method for manufacturing semiconductor device'2005 6,852,621'Semiconductor device and manufacturing method therefor, circuit board, and electronic equipment'2005 6,806,176'Semiconductor device and method of manufacturing the same, circuit board and electronic instrument'2004 6,720,661'Semiconductor device, method of fabricating the same, stack-type semiconductor device, circuit board and electronic instrument'2004 6,707,153'Semiconductor chip with plural resin layers on a surface thereof and method of manufacturing same'2004 6,667,551'Semiconductor device and manufacturing thereof, including a through-hole with a wider intermediate cavity'2003 6,642,615'Semiconductor device and method of manufacturing the same, circuit board and electronic instrument'2003

Career & activity timeline

Assembled from patent assignee/location history and declaration credentials.

2003–2020Patents assigned to SEIKO EPSON CORP (35)· patent assignee history

2003–2020Based in Suwa, JP· patent location history

2014Patents assigned to CHIBA SEIICHI (2)· patent assignee history

2014Patents assigned to ENTA TOSHIYUKI (2)· patent assignee history

2014Patents assigned to HANAOKA TERUNAO (2)· patent assignee history

2014Patents assigned to KOJIMA SHUJI (2)· patent assignee history

Inventor activity

Assignee and location history derived from the patent record.

Assignees

Assignee	Patents	Span
SEIKO EPSON CORP	35	2003–2020
CHIBA SEIICHI	2	2014
ENTA TOSHIYUKI	2	2014
HANAOKA TERUNAOself	2	2014
KOJIMA SHUJI	2	2014

Locations

Location	Patents	Span
Suwa, JP	35	2003–2020