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Inventor

Katsuji Inagaki

Inventor
Hiratsuka, JP

Overview

2→
Patents
2017–2019
Patent span
Electricity
Primary field (CPC H)

Patents· 2 as inventor

Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.

B23Kprimary
B23KSoldering or unsoldering20%
C09KMaterials for miscellaneous applications, not provided for elsewhere20%
H01BCables20%
H01LSemiconductor devices20%
H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h1020%
PatentTitleYear
10,366,963Noble metal paste for bonding of semiconductor element20199,539,671'Precious metal paste for bonding semiconductor element'2017

Career & activity timeline

Assembled from patent assignee/location history and declaration credentials.

2017Patents assigned to AKIYAMA NOBUYUKI (1)· patent assignee history
2017Patents assigned to INAGAKI KATSUJI (1)· patent assignee history
2017Patents assigned to MIYAIRI MASAYUKI (1)· patent assignee history
2017Patents assigned to OGASHIWA TOSHINORI (1)· patent assignee history
2017Patents assigned to TANAKA KIKINZOKU K K (1)· patent assignee history
2017–2019Based in Hiratsuka, JP· patent location history

Inventor activity

Assignee and location history derived from the patent record.

Assignees
AssigneePatentsSpan
AKIYAMA NOBUYUKI12017
INAGAKI KATSUJIself12017
MIYAIRI MASAYUKI12017
OGASHIWA TOSHINORI12017
TANAKA KIKINZOKU K K12017
Locations
LocationPatentsSpan
Hiratsuka, JP22017–2019