Inventor
Douglas Walter Agnew
Inventor
US
Overview
Patents· 9 as inventor
Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.
C23Cprimary
C23CCoating metallic material26%
H10PGeneric processes or apparatus for the manufacture or treatment of devices covered by class h1023%
H01LSemiconductor devices19%
H01JElectric discharge tubes or discharge lamps13%
H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h1010%
H05HPlasma technique3%
H10BElectronic memory devices3%
LOC233%
PatentTitleYear
D1107670Showerhead for a substrate processing system202512,473,633Plasma enhanced atomic layer deposition of silicon-containing films202512,431,349In-situ control of film properties during atomic layer deposition202512,417,943Reducing intralevel capacitance in semiconductor devices202512,400,880Apparatuses for uniform fluid delivery in a multi-station semiconductor processing chamber202512,252,782In-situ PECVD cap layer202512,157,945Thermal atomic layer deposition of silicon-containing films202412,087,574Oxidative conversion in atomic layer deposition processes202412,020,923Low-k ALD gap-fill methods and material2024Career & activity timeline
Assembled from patent assignee/location history and declaration credentials.
2024–2025Patents assigned to LAM RES CORP (9)· patent assignee history
2024–2025Based in US· patent location history
Inventor activity
Assignee and location history derived from the patent record.
Assignees
| Assignee | Patents | Span |
|---|---|---|
| LAM RES CORP | 9 | 2024–2025 |
Locations
| Location | Patents | Span |
|---|---|---|
| US | 9 | 2024–2025 |