Inventor

RANDON K. RICHARDS

Inventor
US

Overview

20→
Patents
2021–2026
Patent span
Electricity
Primary field (CPC H)

Patents· 20 as inventor

Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.

H01Lprimary
H01LSemiconductor devices18%
H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h1018%
H01QAntennas, i.e. radio aerials14%
G06FElectric digital data processing12%
H10PGeneric processes or apparatus for the manufacture or treatment of devices covered by class h1011%
G11CStatic stores10%
H10BElectronic memory devices10%
H05KPrinted circuits4%
Y02DClimate change mitigation technologies in information and communication technologies [ict], i.e. information and communication technologies aiming at the reduction of their own energy use3%
H10DInorganic electric semiconductor devices1%
PatentTitleYear
12,543,610Microelectronic device assemblies, stacked semiconductor die assemblies, and memory device packages202612,412,608Memory device capable of adjusting clock signal based on operating speed and propagation delay of command/address signal202512,199,068Methods of forming microelectronic device assemblies and packages202512,148,711Semiconductor packages and associated methods with antennas and EMI isolation shields202412,112,830Methods for memory power management and memory devices and systems employing the same202411,961,825Microelectronic device assemblies and packages including multiple device stacks and related methods202411,948,921Methods of forming stacked semiconductors die assemblies202411,830,578Memory device capable of adjusting clock signal based on operating speed and propagation delay of command/address signal202311,789,890Memory devices, modules and systems having memory devices with varying physical dimensions, memory formats, and operational capabilities202311,721,742Memory modules and memory packages including graphene layers for thermal management202311,589,480Tubular heat spreaders for memory modules and memory modules incorporating the same202311,514,959Memory device capable of adjusting clock signal based on operating speed and propagation delay of command/address signal202211,508,422Methods for memory power management and memory devices and systems employing the same202211,456,284Microelectronic device assemblies and packages and related methods202211,416,437Memory devices, modules and systems having memory devices with varying physical dimensions, memory formats, and operational capabilities202211,410,973Microelectronic device assemblies and packages and related methods and systems202211,393,794Microelectronic device assemblies and packages including surface mount components202211,362,070Microelectronic device assemblies and packages including multiple device stacks and related methods202211,206,749Tubular heat spreaders for memory modules and memory modules incorporating the same202111,177,222Semiconductor packages and associated methods with antennas and EMI isolation shields2021

Career & activity timeline

Assembled from patent assignee/location history and declaration credentials.

2021–2025Patents assigned to MICRON TECHNOLOGY INC (15)· patent assignee history
2021–2026Based in US· patent location history
2023–2026Patents assigned to LODESTAR LICENSING GROUP LLC (5)· patent assignee history

Inventor activity

Assignee and location history derived from the patent record.

Assignees
AssigneePatentsSpan
MICRON TECHNOLOGY INC152021–2025
LODESTAR LICENSING GROUP LLC52023–2026
Locations
LocationPatentsSpan
US202021–2026