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Inventor

Ulrich TSCHINDERLE

Inventor
AT

Overview

3→
Patents
2023–2026
Patent span
Electricity
Primary field (CPC H)

Patents· 3 as inventor

Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.

H10Pprimary
H10PGeneric processes or apparatus for the manufacture or treatment of devices covered by class h1033%
H01LSemiconductor devices22%
B01FMixing, e.g. dissolving, emulsifying or dispersing11%
B08BCleaning in general11%
C25DProcesses for the electrolytic or electrophoretic production of coatings11%
H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h1011%
PatentTitleYear
12,522,941Plating frame unit for holding a substrate in a chemical and/or electrolytic surface treatment of the substrate202611,942,356Clipping mechanism for fastening a substrate for a surface treatment of the substrate202411,810,796Wafer cleaning method and apparatus therefore2023

Career & activity timeline

Assembled from patent assignee/location history and declaration credentials.

2023Patents assigned to LAM RES AG (1)· patent assignee history
2023–2026Based in AT· patent location history
2024–2026Patents assigned to SEMSYSCO GMBH (2)· patent assignee history

Inventor activity

Assignee and location history derived from the patent record.

Assignees
AssigneePatentsSpan
SEMSYSCO GMBH22024–2026
LAM RES AG12023
Locations
LocationPatentsSpan
AT32023–2026