Inventor
Derryl J. Allman
Inventor
Camas, WA, US
Overview
Patents· 7 as inventor
Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.
H10Dprimary
H10DInorganic electric semiconductor devices36%
H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h1036%
H10PGeneric processes or apparatus for the manufacture or treatment of devices covered by class h1014%
Y10STechnical subjects covered by former uspc cross-reference art collections [xracs] and digests14%
PatentTitleYear
7,358,594'Method of forming a low k polymer E-beam printable mechanical support'20087,098,515'Semiconductor chip with borderless contact that avoids well leakage'20066,972,217'Low k polymer E-beam printable mechanical support'20056,893,937'Method for preventing borderless contact to well leakage'20056,767,842'Implementation of Si-Ge HBT with CMOS process'20046,707,132'High performance Si-Ge device module with CMOS technology'20046,551,901'Method for preventing borderless contact to well leakage'2003Career & activity timeline
Assembled from patent assignee/location history and declaration credentials.
2003–2008Patents assigned to LSI LOGIC CORP (7)· patent assignee history
2003–2008Based in Camas, WA, US· patent location history
Inventor activity
Assignee and location history derived from the patent record.
Assignees
| Assignee | Patents | Span |
|---|---|---|
| LSI LOGIC CORP | 7 | 2003–2008 |
Locations
| Location | Patents | Span |
|---|---|---|
| Camas, Washington, US | 7 | 2003–2008 |