Inventor
John J. Maloney
Inventor
Solon, OH, US
Overview
Patents· 21 as inventor
Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.
C03Cprimary
C03CChemical composition of glasses, glazes or vitreous enamels15%
H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h1015%
H01LSemiconductor devices10%
H05KPrinted circuits6%
H10FInorganic semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation6%
Y02EReduction of greenhouse gas [ghg] emissions, related to energy generation, transmission or distribution6%
Y10TTechnical subjects covered by former us classification6%
C04BLime, magnesia5%
H10KOrganic electric solid-state devices5%
H01GCapacitors4%
PatentTitleYear
10,577,279Grain boundary healing glasses and their use in transparent enamels, transparent colored enamels and opaque enamels202010,562,809Low K dielectric compositions for high frequency applications202010,370,290Passivation glasses for semiconductor devices20199,969,648Induction sealing of inorganic substrates20189,892,853'Mid-K LTCC compositions and devices'20189,871,176'Glass compositions and glass frit composites for use in optical applications'20189,545,682'Hermetically sealed electronic device using solder bonding'20179,540,274'Low-melting lead-free bismuth sealing glasses'20179,499,428'Formation of glass-based seals using focused infrared radiation'20169,272,497'Hermetically sealed electronic device using coated glass flakes'20169,205,505'Hermetically sealed electronic device using solder bonding'20159,156,735'Hermetic sealing of glass plates'20158,134,225'Quad flat no-lead chip carrier with standoff'20127,834,444'Heatplates for heatsink attachment for semiconductor chips'20107,716,992'Sensor, method, and design structure for a low-k delamination sensor'20107,498,673'Heatplates for heatsink attachment for semiconductor chips'20097,405,106'Quad flat no-lead chip carrier with stand-off'20086,894,382'Optimized electronic package'20056,346,493'Decorative glass enamels'20025,725,919'Lead-free glass enamels for decorating glass beverage containers and methods for using the same'19985,228,910'Mixed metal oxide crystalline powders and method for the synthesis thereof'1993Career & activity timeline
Assembled from patent assignee/location history and declaration credentials.
1993–2020Patents assigned to FERRO CORP (15)· patent assignee history
1993–2020Based in Solon, OH, US· patent location history
2005–2012Patents assigned to IBM (6)· patent assignee history
2005–2012Based in Essex Junction, VT, US· patent location history
2012–2018Patents assigned to MALONEY JOHN J (7)· patent assignee history
2015–2018Patents assigned to SRIDHARAN SRINIVASAN (6)· patent assignee history
2015–2017Patents assigned to BLONSKI ROBERT P (5)· patent assignee history
Inventor activity
Assignee and location history derived from the patent record.
Assignees
| Assignee | Patents | Span |
|---|---|---|
| FERRO CORP | 15 | 1993–2020 |
| MALONEY JOHN Jself | 7 | 2012–2018 |
| IBM | 6 | 2005–2012 |
| SRIDHARAN SRINIVASAN | 6 | 2015–2018 |
| BLONSKI ROBERT P | 5 | 2015–2017 |
Locations
| Location | Patents | Span |
|---|---|---|
| Solon, OH, US | 15 | 1993–2020 |
| Essex Junction, VT, US | 6 | 2005–2012 |