Inventor

Toshiki Okui

Inventor

Kanagawa, JP

Overview

1999–2016

Patent span

Physics

Primary field (CPC G)

Patents· 13 as inventor

Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.

G03Fprimary

G03FPhotomechanical production of textured or patterned surfaces, e.g. for printing, for processing of semiconductor devices45%

Y10STechnical subjects covered by former uspc cross-reference art collections [xracs] and digests24%

C08GMacromolecular compounds obtained otherwise than by reactions only involving unsaturated carbon-to-carbon bonds7%

C07DHeterocyclic compounds3%

C08FMacromolecular compounds obtained by reactions only involving carbon-to-carbon unsaturated bonds3%

C08LCompositions of macromolecular compounds3%

H01LSemiconductor devices3%

H05KPrinted circuits3%

H10PGeneric processes or apparatus for the manufacture or treatment of devices covered by class h103%

Y10TTechnical subjects covered by former us classification3%

PatentTitleYear

9,436,084'Positive-working photoresist composition for thick film formation'2016 7,951,522'Chemically amplified positive photoresist composition for thick film, thick-film photoresist laminated product, manufacturing method for thick-film resist pattern, and manufacturing method for connection terminal'2011 7,927,778'Chemically amplified positive photoresist composition for thick film, thick-film photoresist laminated product, manufacturing method for thick-film resist pattern, and manufacturing method for connection terminal'2011 7,462,436'Positive photoresist composition and method of forming resist pattern'2008 7,419,769'Negative photoresist compositions for the formation of thick films, photoresist films and methods of forming bumps using the same'2008 7,169,532'Chemically amplified positive photoresist composition for thick film, thick-film photoresist laminated product, manufacturing method for thick-film resist pattern, and manufacturing method for connection terminal'2007 7,132,213'Positive photoresist composition and method of forming resist pattern'2006 7,129,018'Negative photoresist compositions for the formation of thick films, photoresist films and methods of forming bumps using the same'2006 7,081,327'Chemically amplified positive photoresist composition for thick film, thick-film photoresist laminated product, manufacturing method for thick-film resist pattern, and manufacturing method for connection terminal'2006 7,063,934'Negative photoresist compositions for the formation of thick films, photoresist films and methods of forming bumps using the same'2006 6,838,229'Chemically amplified negative photoresist composition for the formation of thick films, photoresist base material and method of forming bumps using the same'2005 6,641,972'Positive photoresist composition for the formation of thick films, photoresist film and method of forming bumps using the same'2003 5,908,734'Image formation method with a post exposure heating step'1999

Career & activity timeline

Assembled from patent assignee/location history and declaration credentials.

1999–2016Patents assigned to TOKYO OHKA KOGYO CO LTD (11)· patent assignee history

1999–2008Based in Kanagawa, JP· patent location history

2006Patents assigned to TOYKO OHKA KOGYO CO LTD (2)· patent assignee history

2006–2016Based in Kawasaki, JP· patent location history

2016Patents assigned to MISUMI KOICHI (1)· patent assignee history

2016Patents assigned to OKUI TOSHIKI (1)· patent assignee history

Inventor activity

Assignee and location history derived from the patent record.

Assignees

Assignee	Patents	Span
TOKYO OHKA KOGYO CO LTD	11	1999–2016
TOYKO OHKA KOGYO CO LTD	2	2006
MISUMI KOICHI	1	2016
OKUI TOSHIKIself	1	2016

Locations

Location	Patents	Span
Kanagawa, JP	7	1999–2008
Kawasaki, JP	6	2006–2016