Inventor
Michael Friedemann
Inventor
Dresden, DE
Overview
Patents· 4 as inventor
Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.
H10Wprimary
H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h1050%
H10PGeneric processes or apparatus for the manufacture or treatment of devices covered by class h1038%
C23CCoating metallic material13%
PatentTitleYear
7,745,327'Method of forming a copper-based metallization layer including a conductive cap layer by an advanced integration regime'20107,071,096'Method of forming a conductive barrier layer within critical openings by a final deposition step after a re-sputter deposition'20066,984,294'Method of forming a conductive barrier layer having improved coverage within critical openings'20066,841,468'Method of forming a conductive barrier layer having improve adhesion and resistivity characteristics'2005Career & activity timeline
Assembled from patent assignee/location history and declaration credentials.
2005–2010Patents assigned to ADVANCED MICRO DEVICES INC (4)· patent assignee history
2005–2010Based in Dresden, DE· patent location history
Inventor activity
Assignee and location history derived from the patent record.
Assignees
| Assignee | Patents | Span |
|---|---|---|
| ADVANCED MICRO DEVICES INC | 4 | 2005–2010 |
Locations
| Location | Patents | Span |
|---|---|---|
| Dresden, DE | 4 | 2005–2010 |