Inventor

Takeshi Shimazaki

Inventor
Hitachi, JP

Overview

29→
Patents
1982–2020
Patent span
Chemistry
Primary field (CPC C)

Patents· 29 as inventor

Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.

H05Kprimary
H05KPrinted circuits12%
C23CCoating metallic material11%
Y10TTechnical subjects covered by former us classification7%
C08GMacromolecular compounds obtained otherwise than by reactions only involving unsaturated carbon-to-carbon bonds5%
B32BLayered products, i.e. products built-up of strata of flat or non-flat, e.g. cellular or honeycomb, form4%
G01NInvestigating or analysing materials by determining their chemical or physical properties4%
G06FElectric digital data processing4%
G06KGraphical data reading4%
G07GRegistering the receipt of cash, valuables, or tokens4%
H01QAntennas, i.e. radio aerials4%
PatentTitleYear
10,876,983Thermophysical property measurement method and thermophysical property measurement apparatus202010,599,891Antenna control apparatus202010,140,484Antenna control apparatus201810,102,718Payment processor201810,057,461Authentication system, image forming apparatus, terminal apparatus, and authentication method20189,471,265'Image processing system, image processing method, and computer program product'20168,678,653'Shaft member for fluid lubrication bearing apparatuses and a method for producing the same'20148,552,840'Product managing apparatus and control method'20138,387,246'Shaft member for fluid lubrication bearing apparatuses and a method for producing the same'20138,319,644'RFID system and RFID tag reading method'20127,666,332'Process for producing optical glass element'20107,332,809'Glass substrate having a grooved portion, method for fabricating the same, and press mold for fabricating the glass substrate'20086,035,111'Manufacturing method and apparatus of a semiconductor integrated circuit device'20005,793,788'Semiconductor light emitting element with p-type non-alloy electrode including a platinum layer and method for fabricating the same'19985,618,744'Manufacturing method and apparatus of a semiconductor integrated circuit device'19975,569,321'Pre-treating solution for electroless plating'19965,270,659'Apparatus for measuring deposition speed of electroless plating'19935,254,156'Aqueous solution for activation accelerating treatment'19935,206,052'Electroless plating process'19935,198,273'Electroless gold plating solution and method for plating gold therewith'19935,076,840'Electroless copper plating solution'19914,986,848'Catalyst for electroless plating'19914,661,417'Composite of metal and resin having electrolytically reduced metal layer and process for producing the same'19874,642,161'Method of bonding copper and resin'19874,546,168'Thermosetting resin composition comprising (1) dicyanamide, (2) polyvalent imide and (3) polymerizable compound'19854,526,835'Multi-layer printed circuit board and process for production thereof'19854,482,703'Thermosetting resin composition comprising dicyanamide and polyvalent imide'19844,400,438'Process for producing fire retardant and heat resistant copper-clad laminated board, and varnish therefor'19834,346,206'Imide prepolymer from reaction of epoxy compound with bis-imide/diamine reaction mixture'1982

Career & activity timeline

Assembled from patent assignee/location history and declaration credentials.

1982–1996Patents assigned to HITACHI CHEMICAL CO LTD (9)· patent assignee history
1982–1993Based in Hitachi, JP· patent location history
1984–1993Patents assigned to HITACHI LTD (6)· patent assignee history
2008–2010Patents assigned to ASAHI GLASS CO LTD (2)· patent assignee history
2012–2018Patents assigned to SHIMAZAKI TAKESHI (6)· patent assignee history
2012–2020Patents assigned to TOSHIBA TEC KK (5)· patent assignee history
2012–2013Based in Shizuoka, JP· patent location history
2013–2014Based in Awara, JP· patent location history
2016–2018Based in Kanagawa, JP· patent location history
2018–2020Based in Shizuoka-shi, JP· patent location history

Inventor activity

Assignee and location history derived from the patent record.

Assignees
AssigneePatentsSpan
HITACHI CHEMICAL CO LTD91982–1996
HITACHI LTD61984–1993
SHIMAZAKI TAKESHIself62012–2018
TOSHIBA TEC KK52012–2020
ASAHI GLASS CO LTD22008–2010
Locations
LocationPatentsSpan
Hitachi, JP101982–1993
Shizuoka-shi, JP32018–2020
Kanagawa, JP22016–2018
Awara, JP22013–2014
Shizuoka, JP22012–2013