Inventor
JENG-CHI LIN
Inventor
TW
Overview
Patents· 6 as inventor
Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.
H01Lprimary
H01LSemiconductor devices24%
H10PGeneric processes or apparatus for the manufacture or treatment of devices covered by class h1024%
B24BMachines, devices, or processes for grinding or polishing16%
A46BBrushes8%
B08BCleaning in general8%
C09GPolishing compositions4%
G01NInvestigating or analysing materials by determining their chemical or physical properties4%
G06TImage data processing or generation, in general4%
G06VImage or video recognition or understanding4%
H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h104%
PatentTitleYear
12,581,915Apparatus and methods for chemical mechanical polishing202612,568,786Processing tool and method202612,362,201Bevel edge removal methods, tools, and systems202512,347,735In-situ defect count detection in post chemical mechanical polishing202512,131,944Slurry composition, semiconductor structure and method for forming the same202411,664,213Bevel edge removal methods, tools, and systems2023Career & activity timeline
Assembled from patent assignee/location history and declaration credentials.
2023–2026Patents assigned to TAIWAN SEMICONDUCTOR MFG CO LTD (6)· patent assignee history
2023–2026Based in TW· patent location history
Inventor activity
Assignee and location history derived from the patent record.
Assignees
| Assignee | Patents | Span |
|---|---|---|
| TAIWAN SEMICONDUCTOR MFG CO LTD | 6 | 2023–2026 |
Locations
| Location | Patents | Span |
|---|---|---|
| TW | 6 | 2023–2026 |