LexDanaLexDanabeta
Inventor

Kwok Kee Chung

Inventor
Kwai Chung, HK

Overview

3→
Patents
2010–2012
Patent span
Electricity
Primary field (CPC H)

Patents· 3 as inventor

Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.

H10Wprimary
H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h1060%
G05BControl or regulating systems in general20%
H10PGeneric processes or apparatus for the manufacture or treatment of devices covered by class h1020%
PatentTitleYear
8,293,043'Automatic level adjustment for die bonder'20127,854,365'Direct die attach utilizing heated bond head'20107,810,698'Vision system for positioning a bonding tool'2010

Career & activity timeline

Assembled from patent assignee/location history and declaration credentials.

2010–2012Patents assigned to ASM ASSEMBLY AUTOMATION LTD (3)· patent assignee history
2010Based in Kwai Chung, HK· patent location history
2012Patents assigned to CHEUNG WAI YUEN (1)· patent assignee history
2012Patents assigned to CHUNG KWOK KEE (1)· patent assignee history
2012Patents assigned to LAM KUI KAM (1)· patent assignee history
2012Patents assigned to LEUNG CHI KEUNG (1)· patent assignee history
2012Based in Hong Kong, CN· patent location history

Inventor activity

Assignee and location history derived from the patent record.

Assignees
AssigneePatentsSpan
ASM ASSEMBLY AUTOMATION LTD32010–2012
CHEUNG WAI YUEN12012
CHUNG KWOK KEEself12012
LAM KUI KAM12012
LEUNG CHI KEUNG12012
Locations
LocationPatentsSpan
Kwai Chung, HK22010
Hong Kong, CN12012