Inventor
Romel N. Manatad
Inventor
Mandaue, PH
Overview
Patents· 21 as inventor
Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.
H10Wprimary
H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h1075%
H01LSemiconductor devices14%
H05KPrinted circuits4%
H10DInorganic electric semiconductor devices4%
Y02PClimate change mitigation technologies in the production or processing of goods4%
PatentTitleYear
11,088,046Semiconductor device package with clip interconnect and dual side cooling202110,546,847Substrate interposer on a leadframe202010,256,178Vertical and horizontal circuit assemblies20199,698,143'Wireless module with active devices'20178,624,393'Methods and designs for localized wafer thinning'20148,158,506'Methods and designs for localized wafer thinning'20127,906,837'Robust leaded molded packages and methods for forming the same'20117,816,178'Packaged semiconductor device with dual exposed surfaces and method of manufacturing'20107,816,784'Power quad flat no-lead semiconductor die packages with isolated heat sink for high-voltage, high-power applications, systems using the same, and methods of making the same'20107,586,178'Alternative flip chip in leaded molded package design and method for manufacture'20097,582,956'Flip chip in leaded molded package and method of manufacture thereof'20097,576,429'Packaged semiconductor device with dual exposed surfaces and method of manufacturing'20097,560,311'Robust leaded molded packages and methods for forming the same'20097,256,479'Method to manufacture a universal footprint for a package with exposed chip'20077,217,594'Alternative flip chip in leaded molded package design and method for manufacture'20077,215,011'Flip chip in leaded molded package and method of manufacture thereof'20077,154,168'Flip chip in leaded molded package and method of manufacture thereof'20067,122,884'Robust leaded molded packages and methods for forming the same'20066,949,410'Flip chip in leaded molded package and method of manufacture thereof'20056,943,434'Method for maintaining solder thickness in flipchip attach packaging processes'20056,720,642'Flip chip in leaded molded package and method of manufacture thereof'2004Career & activity timeline
Assembled from patent assignee/location history and declaration credentials.
2004–2020Patents assigned to FAIRCHILD SEMICONDUCTOR (20)· patent assignee history
2004–2014Based in Mandaue, PH· patent location history
2007–2020Based in Cebu, PH· patent location history
2012–2014Patents assigned to KIM SUKU (2)· patent assignee history
2012Patents assigned to GRUENHAGEN MICHAEL D (1)· patent assignee history
2014Patents assigned to GRUENHAGEN MICHAEL (1)· patent assignee history
2014Patents assigned to MANATAD ROMEL (1)· patent assignee history
2021Based in Liloan, PH· patent location history
Inventor activity
Assignee and location history derived from the patent record.
Assignees
| Assignee | Patents | Span |
|---|---|---|
| FAIRCHILD SEMICONDUCTOR | 20 | 2004–2020 |
| KIM SUKU | 2 | 2012–2014 |
| GRUENHAGEN MICHAEL | 1 | 2014 |
| GRUENHAGEN MICHAEL D | 1 | 2012 |
| MANATAD ROMELself | 1 | 2014 |
Locations
| Location | Patents | Span |
|---|---|---|
| Mandaue, PH | 15 | 2004–2014 |
| Cebu, PH | 5 | 2007–2020 |
| Liloan, PH | 1 | 2021 |