Inventor
Daniel Patrick Chesire
Inventor
Winter Garden, FL, US
Overview
Patents· 17 as inventor
Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.
H10Wprimary
H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h1037%
H10PGeneric processes or apparatus for the manufacture or treatment of devices covered by class h1023%
G01RMeasuring electric variables10%
B81CProcesses or apparatus specially adapted for the manufacture or treatment of microstructural devices or systems7%
C23FNon-mechanical removal of metallic material from surface7%
H03HImpedance networks, e.g. resonant circuits7%
H01LSemiconductor devices3%
H04BTransmission3%
H10NElectric solid-state devices not otherwise provided for3%
PatentTitleYear
9,973,169Surface acoustic wave filter with a cap layer for improved reliability20189,331,667'Methods, systems, and apparatuses for temperature compensated surface acoustic wave device'20168,319,343'Routing under bond pad for the replacement of an interconnect layer'20127,973,544'Thermal monitoring and management of integrated circuits'20117,777,333'Structure and method for fabricating flip chip devices'20107,476,951'Selective isotropic etch for titanium-based materials'20097,429,502'Integrated circuit device incorporating metallurgical bond to enhance thermal conduction to a heat sink'20087,397,103'Semiconductor with damage detection circuitry'20087,328,830'Structure and method for bonding to copper interconnect structures'20087,327,029'Integrated circuit device incorporating metallurigical bond to enhance thermal conduction to a heat sink'20087,301,231'Reinforced bond pad for a semiconductor device'20077,221,173'Method and structures for testing a semiconductor wafer prior to performing a flip chip bumping process'20077,115,985'Reinforced bond pad for a semiconductor device'20067,078,337'Selective isotropic etch for titanium-based materials'20066,960,836'Reinforced bond pad'20056,153,543'High density plasma passivation layer and method of application'20005,264,377'Integrated circuit electromigration monitor'1993Career & activity timeline
Assembled from patent assignee/location history and declaration credentials.
1993Patents assigned to AT & T BELL LAB (1)· patent assignee history
1993Based in Slatington, PA, US· patent location history
2000–2005Based in Orlando, FL, US· patent location history
2005–2011Patents assigned to AGERE SYSTEMS INC (12)· patent assignee history
2006–2018Based in Winter Garden, FL, US· patent location history
2012Patents assigned to AGERE SYSTEMS LLC (1)· patent assignee history
2012Patents assigned to ARCHER III VANCE D (1)· patent assignee history
2012Patents assigned to AYUKAWA MICHAEL C (1)· patent assignee history
Inventor activity
Assignee and location history derived from the patent record.
Assignees
| Assignee | Patents | Span |
|---|---|---|
| AGERE SYSTEMS INC | 12 | 2005–2011 |
| AGERE SYSTEMS LLC | 1 | 2012 |
| ARCHER III VANCE D | 1 | 2012 |
| AT & T BELL LAB | 1 | 1993 |
| AYUKAWA MICHAEL C | 1 | 2012 |
Locations
| Location | Patents | Span |
|---|---|---|
| Winter Garden, Florida, US | 14 | 2006–2018 |
| Orlando, Florida, US | 2 | 2000–2005 |
| Slatington, Pennsylvania, US | 1 | 1993 |