Inventor
Weifeng Liu
Inventor
Dublin, CA, US
Overview
Patents· 59 as inventor
Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.
H05Kprimary
H05KPrinted circuits14%
H01RElectrically-conductive connections7%
H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h106%
Y02PClimate change mitigation technologies in the production or processing of goods6%
H01MProcesses or means, e.g. batteries, for the direct conversion of chemical energy into electrical energy5%
A41DOuterwear4%
Y02EReduction of greenhouse gas [ghg] emissions, related to energy generation, transmission or distribution4%
D05BSewing4%
B64CAeroplanes3%
B64UUnmanned aerial vehicles [uav]3%
PatentTitleYear
11,004,109Automated creative extension selection for content performance optimization202110,805,542Video processing method, device and image system202010,761,798Systems and methods for gimbal simulation202010,729,624High-ultraviolet absorption lignin/chemical sun-screening agent microcapsule and preparation method therefor202010,733,895Open platform for flight restricted region202010,690,559Pressure sensor array and the method of making202010,687,421Fabric with woven wire braid202010,653,010Connection of multilayer printed conductive ink through filled microvias202010,645,807Component attach on metal woven mesh202010,591,292Method and device for movable object distance detection, and aerial vehicle202010,575,381Electroluminescent display on smart textile and interconnect methods202010,567,700Methods and systems of video processing202010,560,637Image processing system, remotely controlled shooting assembly and exposure information prompt method202010,535,845Flexible and stretchable chain battery202010,447,929Video processing method, device and image system201910,375,8343D printing with components embedded201910,244,623Stretchable printed electronic sheets to electrically connect uneven two dimensional and three dimensional surfaces201910,231,333Copper interconnect for PTH components assembly201910,201,080Integrated system of an electronic module and conductive fabric and method of making the same201910,147,329Open platform for flight restricted region201810,134,298System and method for supporting simulated movement201810,116,785System and method for supporting movable object application development201810,003,087Stretchable printed battery and methods of making20189,872,383'Methods of sewing components in fabrics using metal wire cloth'20189,858,023'Systems and methods for gimbal simulation'20189,839,125Methods of interconnecting components on fabrics using metal braids20179,801,277'Bellows interconnect'20179,763,326'Methods of attaching components on fabrics using metal braids'2017D0795269'Display screen or portion thereof with graphical user interface'20179,736,932'Magnet wire for 3D electronic circuitry'20179,699,902'Printed circuit board made through sintering copper nano-particles'2017D0790593'Display screen or portion thereof with graphical user interface'2017D0790592'Display screen or portion thereof with graphical user interface'20179,684,864'Method of making RFID antenna by placing wire on fabric'20179,674,952'Method of making copper pillar with solder cap'20179,674,949'Method of making stretchable interconnect using magnet wires'20179,674,950'Methods of stitching components on fabrics using metal foils'20179,659,359'Method of and device for quality control process optimization'20179,566,764'Fast cure conductive epoxy attach methodology for high speed automated processes'20179,554,465'Stretchable conductor design and methods of making'20179,510,649'Using a snap button to make disconnectable connection of electronic devices to fabrics'20169,466,597'Chip package structure and chip packaging method'20169,449,942'Method of making RFID devices on fabrics by stitching metal wires'20169,398,714'Method of attaching electronic module on fabrics by stitching metal foil'20169,398,705'Stretchable printed electronic sheets to electrically connect uneven two dimensional and three dimensional surfaces'20169,378,864'Stretchable metal wire assembly using elastic tube'20169,338,915'Method of attaching electronic module on fabrics by stitching plated through holes'20169,336,476'Method of making RFID devices on fabrics by stitching metal wires'20169,318,407'Pop package structure'20169,269,371'Adaptive systems using correntropy'20169,257,358'Chip stacking packaging structure'20169,231,327'Electronic circuit slidable interconnect'20169,053,405'Printed RFID circuit'20158,952,533'Devices and methods for 2.5D interposers'20158,611,839'Robust signal detection using correntropy'2013D0634671'Automobile'20117,825,512'Electronic package with compliant electrically-conductive ball interconnect'20107,742,311'Damage prevention interposer for electronic package and electronic interconnect structure'20106,799,977'Socket having foam metal contacts'2004Career & activity timeline
Assembled from patent assignee/location history and declaration credentials.
2004–2010Patents assigned to HEWLETT PACKARD DEVELOPMENT CO (3)· patent assignee history
2004–2010Based in Roseville, CA, US· patent location history
2015–2020Patents assigned to FLEXTRONICS AP LLC (28)· patent assignee history
2015–2020Based in Dublin, CA, US· patent location history
2016Patents assigned to HUAWEI TECH CO LTD (3)· patent assignee history
2016–2020Based in Shenzhen, CN· patent location history
2017–2020Patents assigned to SZ DJI TECHNOLOGY CO LTD (14)· patent assignee history
2018Based in Fremont, CA, US· patent location history
2020Patents assigned to FLEX LTD (5)· patent assignee history
2021Based in Beijing, CN· patent location history
Inventor activity
Assignee and location history derived from the patent record.
Assignees
| Assignee | Patents | Span |
|---|---|---|
| FLEXTRONICS AP LLC | 28 | 2015–2020 |
| SZ DJI TECHNOLOGY CO LTD | 14 | 2017–2020 |
| FLEX LTD | 5 | 2020 |
| HEWLETT PACKARD DEVELOPMENT CO | 3 | 2004–2010 |
| HUAWEI TECH CO LTD | 3 | 2016 |
Locations
| Location | Patents | Span |
|---|---|---|
| Dublin, California, US | 34 | 2015–2020 |
| Shenzhen, CN | 15 | 2016–2020 |
| Roseville, California, US | 3 | 2004–2010 |
| Fremont, California, US | 2 | 2018 |
| Beijing, CN | 1 | 2021 |