Inventor
Ulrich Vidal
Inventor
Landshut, DE
Overview
Patents· 4 as inventor
Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.
H10Wprimary
H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h10100%
PatentTitleYear
7,276,781'Multichip module for LOC mounting and method for producing the multichip module'20076,541,311'Method of positioning a component mounted on a lead frame in a test socket'20036,262,476'Composite member composed of at least two integrated circuits and method for the manufacture of a composite member composed of at least two integrated circuits'20016,144,088'Leadframe for semiconductor chips and semiconductor module having the lead frame'2000Career & activity timeline
Assembled from patent assignee/location history and declaration credentials.
2000–2007Patents assigned to INFINEON TECHNOLOGIES AG (3)· patent assignee history
2000Based in Regensburg, DE· patent location history
2001Patents assigned to SIEMENS AG (1)· patent assignee history
2001–2007Based in Landshut, DE· patent location history
Inventor activity
Assignee and location history derived from the patent record.
Assignees
| Assignee | Patents | Span |
|---|---|---|
| INFINEON TECHNOLOGIES AG | 3 | 2000–2007 |
| SIEMENS AG | 1 | 2001 |
Locations
| Location | Patents | Span |
|---|---|---|
| Landshut, DE | 3 | 2001–2007 |
| Regensburg, DE | 1 | 2000 |