Inventor
Shwang-Ming Jeng
Inventor
Hsinchu, TW
Overview
Patents· 35 as inventor
Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.
H10Wprimary
H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h1040%
H10PGeneric processes or apparatus for the manufacture or treatment of devices covered by class h1028%
H01LSemiconductor devices12%
H10DInorganic electric semiconductor devices7%
A44BButtons, pins, buckles, slide fasteners, or the like2%
B29CShaping or joining of plastics2%
B29LIndexing scheme associated with subclass b29c, relating to particular articles2%
B24BMachines, devices, or processes for grinding or polishing1%
C23CCoating metallic material1%
G01RMeasuring electric variables1%
PatentTitleYear
10,510,580Dummy fin structures and methods of forming same201910,312,107Forming interconnect structure using plasma treated metal hard mask201910,144,109Polisher, polishing tool, and polishing method20189,589,856'Automatically adjusting baking process for low-k dielectric material'20179,368,452'Metal conductor chemical mechanical polish'20169,196,551'Automatically adjusting baking process for low-k dielectric material'20159,087,877'Low-k interconnect structures with reduced RC delay'20159,004,914'Method of and apparatus for active energy assist baking'20158,993,435'Low-k Cu barriers in damascene interconnect structures'20158,877,083'Surface treatment in the formation of interconnect structure'20148,853,858'Curing low-k dielectrics for improving mechanical strength'20148,703,612'Process for forming contact plugs'20148,673,783'Metal conductor chemical mechanical polish'20148,481,412'Method of and apparatus for active energy assist baking'20138,324,731'Integrated circuit device'20128,258,629'Curing low-k dielectrics for improving mechanical strength'20128,105,947'Post etch dielectric film re-capping layer'2012RE042514'Extreme low-K dielectric film scheme for advanced interconnects'2011RE041935'Method for preventing low-k dielectric layer cracking in multi-layered dual damascene metallization layers'20107,805,692'Method for local hot spot fixing'20107,723,226'Interconnects containing bilayer porous low-k dielectrics using different porogen to structure former ratio'20107,646,097'Bond pads and methods for fabricating the same'20107,626,245'Extreme low-k dielectric film scheme for advanced interconnect'20097,485,949'Semiconductor device'20097,465,676'Method for forming dielectric film to improve adhesion of low-k film'20087,365,026'CxHy sacrificial layer for cu/low-k interconnects'20087,042,049'Composite etching stop in semiconductor process integration'20066,869,836'ILD stack with improved CMP results'20056,846,756'Method for preventing low-k dielectric layer cracking in multi-layered dual damascene metallization layers'20056,821,905'Method for avoiding carbon and nitrogen contamination of a dielectric insulating layer'20046,753,260'Composite etching stop in semiconductor process integration'20046,657,284'Graded dielectric layer and method for fabrication thereof'20036,620,745'Method for forming a blocking layer'20036,372,661'Method to improve the crack resistance of CVD low-k dielectric constant material'20026,319,809'Method to reduce via poison in low-k Cu dual damascene by UV-treatment'2001Career & activity timeline
Assembled from patent assignee/location history and declaration credentials.
2001–2019Based in Hsinchu, TW· patent location history
2002–2016Patents assigned to TAIWAN SEMICONDUCTOR MFG (30)· patent assignee history
2002–2005Based in Hsin-Tien, TW· patent location history
2012–2015Patents assigned to JENG SHWANG-MING (10)· patent assignee history
2012–2015Patents assigned to LIN KENG-CHU (7)· patent assignee history
2012–2015Patents assigned to KO CHUNG-CHI (5)· patent assignee history
2017–2019Patents assigned to TAIWAN SEMICONDUCTOR MFG CO LTD (4)· patent assignee history
Inventor activity
Assignee and location history derived from the patent record.
Assignees
| Assignee | Patents | Span |
|---|---|---|
| TAIWAN SEMICONDUCTOR MFG | 30 | 2002–2016 |
| JENG SHWANG-MINGself | 10 | 2012–2015 |
| LIN KENG-CHU | 7 | 2012–2015 |
| KO CHUNG-CHI | 5 | 2012–2015 |
| TAIWAN SEMICONDUCTOR MFG CO LTD | 4 | 2017–2019 |
Locations
| Location | Patents | Span |
|---|---|---|
| Hsinchu, TW | 32 | 2001–2019 |
| Hsin-Tien, TW | 3 | 2002–2005 |