LexDanaLexDanabeta
Inventor

Christopher M. Scanlan

Inventor
Chandler, AZ, US

Overview

70→
Patents
1998–2020
Patent span
Electricity
Primary field (CPC H)

Patents· 70 as inventor

Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.

H10Wprimary
H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h1040%
H01LSemiconductor devices21%
H10PGeneric processes or apparatus for the manufacture or treatment of devices covered by class h1020%
H05KPrinted circuits5%
G06FElectric digital data processing4%
Y02PClimate change mitigation technologies in the production or processing of goods4%
G06TImage data processing or generation, in general1%
Y10TTechnical subjects covered by former us classification1%
B23KSoldering or unsoldering1%
C04BLime, magnesia1%
PatentTitleYear
10,818,635Fully molded semiconductor package for power devices and method of making the same202010,720,417Thermally enhanced fully molded fan-out module202010,672,624Method of making fully molded peripheral package on package device202010,573,601Semiconductor device and method of unit specific progressive alignment202010,373,902Fully molded miniaturized semiconductor module201910,373,870Semiconductor device and method of packaging201910,373,913Method of marking a semiconductor package201910,157,803Semiconductor device and method of unit specific progressive alignment201810,056,304Automated optical inspection of unit specific patterning201810,050,004Fully molded peripheral package on package device20189,978,655Semiconductor device and method of adaptive patterning for panelized packaging with dynamic via clipping20189,887,103'Semiconductor device and method of adaptive patterning for panelized packaging'20189,831,170Fully molded miniaturized semiconductor module20179,768,124'Semiconductor package in package'20179,761,571'Thermally enhanced fully molded fan-out module'20179,754,835'Semiconductor device and method comprising redistribution layers'20179,613,912'Method of marking a semiconductor package'20179,613,830'Fully molded peripheral package on package device'20179,576,919'Semiconductor device and method comprising redistribution layers'20179,520,331'Adaptive patterning for panelized packaging'20169,520,364'Front side package-level serialization for packages comprising unique identifiers'20169,502,397'3D interconnect component for fully molded packages'20169,464,362'Magnetically sealed wafer plating jig system and method'20169,466,545'Semiconductor package in package'20169,418,905'Adaptive patterning for panelized packaging'20169,401,313'Automated optical inspection of unit specific patterning'20169,397,069'Semiconductor device and method of adaptive patterning for panelized packaging with dynamic via clipping'20169,337,086'Die up fully molded fan-out wafer level packaging'20169,269,622'Semiconductor device and method of land grid array packaging with bussing lines'20169,196,509'Semiconductor device and method of adaptive patterning for panelized packaging'20159,177,926'Semiconductor device and method comprising thickened redistribution layers'20159,040,316'Semiconductor device and method of adaptive patterning for panelized packaging with dynamic via clipping'20158,922,021'Die up fully molded fan-out wafer level packaging'20148,835,230'Fully molded fan-out'20148,826,221'Adaptive patterning for panelized packaging'20148,799,845'Adaptive patterning for panelized packaging'20148,796,561'Fan out build up substrate stackable package and method'20148,656,333'Integrated circuit package auto-routing'20148,629,546'Stacked redistribution layer (RDL) die assembly package'20148,604,600'Fully molded fan-out'20138,535,978'Die up fully molded fan-out wafer level packaging'20138,319,338'Thin stacked interposer package'20128,299,610'Semiconductor device having RF shielding and method therefor'20128,227,338'Semiconductor package including a top-surface metal layer for implementing circuit features'20128,203,203'Stacked redistribution layer (RDL) die assembly package'20128,093,691'System and method for RF shielding of a semiconductor package'20128,018,068'Semiconductor package including a top-surface metal layer for implementing circuit features'20117,960,827'Thermal via heat spreader package and method'20117,898,066'Semiconductor device having EMI shielding and method therefor'20117,859,116'Exposed metal bezel for use in sensor devices and method therefor'20107,851,894'System and method for shielding of package on package (PoP) assemblies'20107,829,990'Stackable semiconductor package including laminate interposer'20107,825,520'Stacked redistribution layer (RDL) die assembly package'20107,781,852'Membrane die attach circuit element package and method therefor'20107,777,351'Thin stacked interposer package'20107,745,910'Semiconductor device having RF shielding and method therefor'20107,732,899'Etch singulated semiconductor package'20107,633,765'Semiconductor package including a top-surface metal layer for implementing circuit features'20097,550,857'Stacked redistribution layer (RDL) die assembly package'20097,507,603'Etch singulated semiconductor package'20097,342,303'Semiconductor device having RF shielding and method therefor'20087,049,682'Multi-chip semiconductor package with integral shield and antenna'20066,686,649'Multi-chip semiconductor package with integral shield and antenna'20046,546,620'Flip chip integrated circuit and passive chip component package fabrication method'20036,494,361'Semiconductor module package substrate fabrication method'20026,445,075'Semiconductor module package substrate'20026,356,453'Electronic package having flip chip integrated circuit and passive chip component'20025,898,128'Electronic component'19995,786,097'Assembly substrate and method of making'19985,751,552'Semiconductor device balancing thermal expansion coefficient mismatch'1998

Career & activity timeline

Assembled from patent assignee/location history and declaration credentials.

1998–1999Patents assigned to MOTOROLA INC (3)· patent assignee history
1998–2006Based in Phoenix, AZ, US· patent location history
2002–2017Patents assigned to AMKOR TECHNOLOGY INC (29)· patent assignee history
2008–2020Based in Chandler, AZ, US· patent location history
2010–2012Based in Hellerup, DK· patent location history
2012–2016Patents assigned to SCANLAN CHRISTOPHER M (8)· patent assignee history
2012–2016Patents assigned to BERRY CHRISTOPHER J (3)· patent assignee history
2013–2020Patents assigned to DECA TECHNOLOGIES INC (37)· patent assignee history

Inventor activity

Assignee and location history derived from the patent record.

Assignees
AssigneePatentsSpan
DECA TECHNOLOGIES INC372013–2020
AMKOR TECHNOLOGY INC292002–2017
SCANLAN CHRISTOPHER Mself82012–2016
BERRY CHRISTOPHER J32012–2016
MOTOROLA INC31998–1999
Locations
LocationPatentsSpan
Chandler, AZ, US582008–2020
Phoenix, AZ, US91998–2006
Hellerup, DK32010–2012