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Inventor

Ding-Jeng Yu

Inventor
Hsin Chu, TW

Overview

6→
Patents
2000–2011
Patent span
Electricity
Primary field (CPC H)

Patents· 6 as inventor

Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.

H10Dprimary
H10DInorganic electric semiconductor devices50%
H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h1025%
C23CCoating metallic material13%
Y10STechnical subjects covered by former uspc cross-reference art collections [xracs] and digests13%
PatentTitleYear
8,044,466'ESD protection device in high voltage and manufacturing method for the same'20117,880,234'NPN Darlington ESD protection circuit'20117,491,584'ESD protection device in high voltage and manufacturing method for the same'20097,203,050'NPN Darlington ESD protection circuit'20076,479,376'Process improvement for the creation of aluminum contact bumps'20026,130,149'Approach for aluminum bump process'2000

Career & activity timeline

Assembled from patent assignee/location history and declaration credentials.

2000–2002Patents assigned to TAIWAN SEMICONDUCTOR MFG (2)· patent assignee history
2000–2002Based in Taipei, TW· patent location history
2007–2011Patents assigned to MEDIATEK INC (4)· patent assignee history
2007–2011Based in Hsinchu, TW· patent location history
2009–2011Based in Hsin Chu, TW· patent location history

Inventor activity

Assignee and location history derived from the patent record.

Assignees
AssigneePatentsSpan
MEDIATEK INC42007–2011
TAIWAN SEMICONDUCTOR MFG22000–2002
Locations
LocationPatentsSpan
Hsin Chu, TW22009–2011
Hsinchu, TW22007–2011
Taipei, TW22000–2002