Inventor
Daoqiang Lu
Inventor
Chandler, AZ, US
Overview
Patents· 88 as inventor
Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.
H10Wprimary
H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h1034%
G02BOptical elements, systems or apparatus13%
H10PGeneric processes or apparatus for the manufacture or treatment of devices covered by class h109%
C09JAdhesives7%
H05KPrinted circuits7%
B23KSoldering or unsoldering4%
Y10TTechnical subjects covered by former us classification4%
B32BLayered products, i.e. products built-up of strata of flat or non-flat, e.g. cellular or honeycomb, form3%
C08LCompositions of macromolecular compounds3%
Y10STechnical subjects covered by former uspc cross-reference art collections [xracs] and digests3%
PatentTitleYear
10,717,907Photo-curable adhesive composition, preparation and use thereof202010,308,846Ultra-violet-curable and moisture-curable adhesive composition201910,093,837Process for binding substrates with a liquid optically clear photo-curable adhesive20189,783,710'Triply curable optically clear adhesive'20179,783,713'Dual-curable adhesive composition, use thereof, and process for bonding substrates'20179,708,518'Optical transparent dual cure adhesives composition'20179,663,685'Photocurable adhesive composition and use of the same'20179,511,453'Solder paste composition, a solder paste and a soldering flux'20169,508,675'Microelectronic package having direct contact heat spreader and method of manufacturing same'20169,039,852'Method for bonding substrates using a UV radiation curing-redox curing adhesive system'20158,642,386'Heat spreader as mechanical reinforcement for ultra-thin die'20148,541,876'Microelectronic package having direct contact heat spreader and method of manufacturing same'20138,230,589'Method of mounting an optical device'20128,193,072'Semiconductor wafer coat layers and methods therefor'20128,189,361'Multi-chip assembly with optically coupled die'20128,148,805'Forming compliant contact pads for semiconductor packages'20128,063,482'Heat spreader as mechanical reinforcement for ultra-thin die'20118,012,808'Integrated micro-channels for 3D through silicon architectures'20117,980,865'Substrate with raised edge pads'20117,945,127'Electrically pluggable optical interconnect'20117,939,922'Forming compliant contact pads for semiconductor packages'20117,897,486'Semiconductor wafer coat layers and methods therefor'20117,851,809'Multi-chip assembly with optically coupled die'20107,767,486'High-volume on-wafer heterogeneous packaging of optical interconnects'20107,723,164'Dual heat spreader panel assembly method for bumpless die-attach packages, packages containing same, and systems containing same'20107,720,337'Wafer based optical interconnect'20107,713,839'Diamond substrate formation for electronic assemblies'20107,714,430'Substrate with lossy material insert'20107,703,991'Flip-chip mountable optical connector for chip-to-chip optical interconnectability'20107,682,876'Electronic assemblies having a low processing temperature'20107,684,660'Methods and apparatus to mount a waveguide to a substrate'20107,675,182'Die warpage control'20107,670,866'Multi-die molded substrate integrated circuit device'20107,666,714'Assembly of thin die coreless package'20107,659,143'Dual-chip integrated heat spreader assembly, packages containing same, and systems containing same'20107,626,251'Microelectronic die assembly having thermally conductive element at a backside thereof and method of making same'20097,564,066'Multi-chip assembly with optically coupled die'20097,554,203'Electronic assembly with stacked IC\'s using two or more different connection technologies and methods of manufacture'20097,553,386'Adhesive with differential optical properties and its application for substrate processing'20097,538,019'Forming compliant contact pads for semiconductor packages'20097,535,689'Reducing input capacitance of high speed integrated circuits'20097,534,715'Methods including fluxless chip attach processes'20097,518,238'Mounting flexible circuits onto integrated circuit substrates'20097,507,604'Breakable interconnects and structures formed thereby'20097,504,318'Nanopowder coating for scribing and structures formed thereby'20097,476,568'Wafer-level assembly of heat spreaders for dual IHS packages'20097,435,664'Wafer-level bonding for mechanically reinforced ultra-thin die'20087,432,592'Integrated micro-channels for 3D through silicon architectures'20087,407,085'Apparatus and method for attaching a semiconductor die to a heat spreader'20087,393,468'Adhesive with differential optical properties and its application for substrate processing'20087,372,120'Methods and apparatus to optically couple an optoelectronic chip to a waveguide'20087,373,033'Chip-to-chip optical interconnect'20087,348,678'Integrated circuit package to provide high-bandwidth communication among multiple dice'20087,344,318'Optical interconnect with passive optical alignment'20087,344,383'Split socket optical interconnect'20087,334,946'Passively aligned optical-electrical interface with microlenses'20087,319,048'Electronic assemblies having a low processing temperature'20087,303,944'Microelectronic devices having underfill materials with improved fluxing agents'20077,288,438'Solder deposition on wafer backside for thin-die thermal interface material'20077,283,699'Optical package'20077,279,359'High performance amine based no-flow underfill materials for flip chip applications'20077,279,720'Large bumps for optical flip chips'20077,279,362'Semiconductor wafer coat layers and methods therefor'20077,256,059'Underfill integration for optical packages'20077,251,389'Embedded on-die laser source and optical interconnect'20077,238,605'Circuit structures and methods of forming circuit structures with minimal dielectric constant layers'20077,236,666'On-substrate microlens to couple an off-substrate light emitter and/or receiver with an on-substrate optical device'20077,226,812'Wafer support and release in wafer processing'20077,220,622'Method for attaching a semiconductor die to a substrate and heat spreader'20077,195,941'Optical devices and methods to construct the same'20077,177,504'Manufacturable connectorization process for optical chip-to-chip interconnects'20077,153,765'Method of assembling soldered packages utilizing selective solder deposition by self-assembly of nano-sized solder particles'20067,085,449'Waveguide coupling mechanism'20067,068,892'Passively aligned optical-electrical interface'20067,061,099'Microelectronic package having chamber sealed by material including one or more intermetallic compounds'20067,059,045'Method for handling integrated circuit die'20067,045,452'Circuit structures and methods of forming circuit structures with minimal dielectric constant layers'20067,042,106'Underfill integration for optical packages'20067,038,316'Bumpless die and heat spreader lid module bonded to bumped die carrier'20067,026,376'Fluxing agent for underfill materials'20067,023,089'Low temperature packaging apparatus and method'20067,009,289'Fluxless die-to-heat spreader bonding using thermal interface material'20066,933,171'Large bumps for optical flip chips'20056,833,289'Fluxless die-to-heat spreader bonding using thermal interface material'20046,834,133'Optoelectronic packages and methods to simultaneously couple an optoelectronic chip to a waveguide and substrate'20046,792,179'Optical thumbtack'20046,740,192'Joining electroconductive materials with electroconductive adhesive containing epoxide-modified polyurethane'20046,344,157'Conductive and resistive materials with electrical stability for use in electronics devices'2002Career & activity timeline
Assembled from patent assignee/location history and declaration credentials.
2002Based in Allentown, PA, US· patent location history
2004–2016Patents assigned to INTEL CORP (77)· patent assignee history
2004–2020Based in Chandler, AZ, US· patent location history
2004Based in Atlanta, GA, US· patent location history
2011–2016Patents assigned to LU DAOQIANG (9)· patent assignee history
2015–2019Patents assigned to Henkel IP & Holding GmbH (6)· patent assignee history
2016–2020Patents assigned to HENKEL AG & CO KGAA (8)· patent assignee history
2016–2019Based in Shanghai, CN· patent location history
2017Patents assigned to HENKEL (CHINA) COMPANY LTD (3)· patent assignee history
Inventor activity
Assignee and location history derived from the patent record.
Assignees
| Assignee | Patents | Span |
|---|---|---|
| INTEL CORP | 77 | 2004–2016 |
| LU DAOQIANGself | 9 | 2011–2016 |
| HENKEL AG & CO KGAA | 8 | 2016–2020 |
| Henkel IP & Holding GmbH | 6 | 2015–2019 |
| HENKEL (CHINA) COMPANY LTD | 3 | 2017 |
Locations
| Location | Patents | Span |
|---|---|---|
| Chandler, AZ, US | 82 | 2004–2020 |
| Shanghai, CN | 4 | 2016–2019 |
| Atlanta, Georgia, US | 1 | 2004 |
| Allentown, Pennsylvania, US | 1 | 2002 |