Inventor
Tyler Jandt
Inventor
Rochester, MN, US
Overview
Patents· 24 as inventor
Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.
H05Kprimary
H05KPrinted circuits21%
G05BControl or regulating systems in general8%
G06FElectric digital data processing8%
H01RElectrically-conductive connections7%
H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h107%
B60WConjoint control of vehicle sub-units of different type or different function6%
F16HGearing6%
G01CMeasuring distances, levels or bearings6%
G08GTraffic control systems6%
H01LSemiconductor devices6%
PatentTitleYear
11,132,036Implementing enhanced component reliability using air flow control202111,071,235Airflow balancing assembly202110,944,191Offset ;lug connector on a board connection area202110,758,938Pre-treating polymer tubing or hose with a hydrophobic coating to reduce depletion of corrosion inhibitor202010,750,608Logic-to-chassis printed circuit board (PCB) bolt and washer assembly202010,310,481Dynamic position control for electronic components201910,295,354Preventive measures for a cognitive impaired user201910,293,372Pre-treating polymer tubing or hose with a hydrophobic coating to reduce depletion of corrosion inhibitor201910,274,440Method to facilitate investigation of chemical constituents in chemical analysis data201910,256,578Active cable heat sink201910,247,560Preventive measures for a cognitive impaired user201910,247,561Preventive measures for a cognitive impaired user201910,170,850Adjusting an opening of a card edge connector using a set of electroactive polymers201910,136,563Active perforation for advanced server cooling20189,995,590Preventive measures for a cognitive impaired user20189,929,485'Card edge connector using a set of electroactive polymers'20189,907,210'Active perforation for advanced server cooling'20189,893,474'Active cable heat sink'20189,869,983'Cooling system leak detection'20189,851,710Dynamic position control for electronic components20179,740,192'Dynamic position control for electronic components'20179,383,733'Dynamic position control for electronic components'20169,287,190'Devices employing semiconductor die having hydrophobic coatings, and related cooling methods'20169,220,183'Devices employing semiconductor die having hydrophobic coatings, and related cooling methods'2015Career & activity timeline
Assembled from patent assignee/location history and declaration credentials.
2015–2021Patents assigned to IBM (24)· patent assignee history
2015–2021Based in Rochester, MN, US· patent location history
Inventor activity
Assignee and location history derived from the patent record.
Assignees
| Assignee | Patents | Span |
|---|---|---|
| IBM | 24 | 2015–2021 |
Locations
| Location | Patents | Span |
|---|---|---|
| Rochester, Minnesota, US | 24 | 2015–2021 |