Inventor

Scott Chang

Inventor
Taipei, TW

Overview

3→
Patents
2017–2019
Patent span
Performing operations
Primary field (CPC B)

Patents· 3 as inventor

Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.

B24Bprimary
B24BMachines, devices, or processes for grinding or polishing23%
G01NInvestigating or analysing materials by determining their chemical or physical properties15%
B24DTools for grinding, buffing or sharpening8%
B26DCutting8%
B29CShaping or joining of plastics8%
B29KIndexing scheme associated with subclasses b29b, b29c or b29d, relating to moulding materials or to materials for moulds, reinforcements, fillers or preformed parts, e.g. inserts8%
B29LIndexing scheme associated with subclass b29c, relating to particular articles8%
H01LSemiconductor devices8%
H10PGeneric processes or apparatus for the manufacture or treatment of devices covered by class h108%
H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h108%

Career & activity timeline

Assembled from patent assignee/location history and declaration credentials.

2017–2019Patents assigned to DOW GLOBAL TECHNOLOGIES LLC (3)· patent assignee history
2017–2019Patents assigned to ROHM & HAAS ELECT MATERIALS CMP HOLDINGS INC (3)· patent assignee history
2017–2019Based in Taipei, TW· patent location history
2019Patents assigned to ROHM AND HAAS ELECTRONIC MATERICALS CMP HOLDINGS INC (1)· patent assignee history

Inventor activity

Assignee and location history derived from the patent record.

Assignees
AssigneePatentsSpan
DOW GLOBAL TECHNOLOGIES LLC32017–2019
ROHM & HAAS ELECT MATERIALS CMP HOLDINGS INC32017–2019
ROHM AND HAAS ELECTRONIC MATERICALS CMP HOLDINGS INC12019
Locations
LocationPatentsSpan
Taipei, TW32017–2019