Inventor

Hee Sung Shim

Inventor
Gangneung-si, KR

Overview

29→
Patents
2006–2019
Patent span
Electricity
Primary field (CPC H)

Patents· 29 as inventor

Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.

H10Fprimary
H10FInorganic semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation60%
H04NPictorial communication, e.g. television17%
H10DInorganic electric semiconductor devices9%
H01LSemiconductor devices3%
H03MCoding3%
H10BElectronic memory devices3%
H10PGeneric processes or apparatus for the manufacture or treatment of devices covered by class h103%
H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h103%
PatentTitleYear
10,326,467Analog-to-digital converter201910,194,106Image sensor and sensing method thereof201910,009,562Image sensor including active pixel area and dark pixel area correction20189,961,287Image sensor20189,667,891'Image sensor'20179,456,160'Image sensor'20169,124,836'Image sensor and method of driving the same'20158,237,100'Image sensor including two image sensing devices in a pixel and method for manufacturing the same'20128,222,587'Image sensor and method for manufacturing the same'20128,039,324'Image sensor and method of fabricating the same'20117,884,401'CMOS image sensor and manufacturing method thereof'20117,880,196'Image sensor and method for manufacturing the same'20117,867,808'Image sensor and method for manufacturing the same'20117,855,407'CMOS image sensor and method for manufacturing the same'20107,838,955'Image sensor and method for manufacturing the same'20107,632,699'Method for manufacturing CMOS image sensor'20097,598,135'Method for fabricating CMOS image sensor'20097,595,210'Method of manufacturing complementary metal oxide semiconductor image sensor'20097,595,216'Method for manufacturing CMOS image sensor'20097,592,196'Method for fabricating a CMOS image sensor'20097,582,502'Method for manufacturing back side illumination image sensor'20097,531,391'CMOS image sensor and method for manufacturing the same'20097,405,437'CMOS image sensor and method for fabricating the same'20087,375,019'Image sensor and method for fabricating the same'20087,361,542'Method of fabricating CMOS image sensor'20087,294,522'CMOS image sensor and method for fabricating the same'20077,179,675'Method for fabricating image sensor'20077,170,127'Semiconductor device and fabricating method thereof'20076,995,066'Method of fabricating semiconductor device by using sacrifice layer for forming diffusion regions'2006

Career & activity timeline

Assembled from patent assignee/location history and declaration credentials.

2006–2019Based in Seoul, KR· patent location history
2007–2009Patents assigned to DONGBU ELECTRONICS CO LTD (10)· patent assignee history
2009–2018Patents assigned to DONGBU HITEK CO LTD (15)· patent assignee history
2009–2019Based in Gangneung-si, KR· patent location history
2011Based in Gangnam-gu, KR· patent location history
2012–2017Patents assigned to SHIM HEE SUNG (4)· patent assignee history
2012Based in Gangwon-do, KR· patent location history
2017Patents assigned to CHAE MIN AH (1)· patent assignee history
2019Patents assigned to DB HITEK CO LTD (2)· patent assignee history

Inventor activity

Assignee and location history derived from the patent record.

Assignees
AssigneePatentsSpan
DONGBU HITEK CO LTD152009–2018
DONGBU ELECTRONICS CO LTD102007–2009
SHIM HEE SUNGself42012–2017
DB HITEK CO LTD22019
CHAE MIN AH12017
Locations
LocationPatentsSpan
Gangneung-si, KR162009–2019
Seoul, KR102006–2019
Gangwon-do, KR22012
Gangnam-gu, KR12011