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Inventor

Yongan Xu

Inventor
Niskayuna, NY, US

Overview

4→
Patents
2020–2021
Patent span
Electricity
Primary field (CPC H)

Patents· 4 as inventor

Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.

H01Lprimary
H01LSemiconductor devices30%
H10PGeneric processes or apparatus for the manufacture or treatment of devices covered by class h1030%
G03FPhotomechanical production of textured or patterned surfaces, e.g. for printing, for processing of semiconductor devices20%
E21BEarth or rock drilling10%
H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h1010%
PatentTitleYear
11,037,822Svia using a single damascene interconnect202111,031,246EUV pattern transfer with ion implantation and reduced impact of resist residue202111,022,887Tunable adhesion of EUV photoresist on oxide surface202110,724,300Downhole drilling tool system of torque self-balancing2020

Career & activity timeline

Assembled from patent assignee/location history and declaration credentials.

2020Patents assigned to UNIV JILIN (1)· patent assignee history
2020Based in Changchun, CN· patent location history
2021Patents assigned to IBM (3)· patent assignee history
2021Based in Niskayuna, NY, US· patent location history
2021Based in San Jose, CA, US· patent location history

Inventor activity

Assignee and location history derived from the patent record.

Assignees
AssigneePatentsSpan
IBM32021
UNIV JILIN12020
Locations
LocationPatentsSpan
Niskayuna, New York, US22021
San Jose, California, US12021
Changchun, CN12020