Inventor
HSIANG-TAI LU
Inventor
TW
Overview
Patents· 11 as inventor
Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.
H01Lprimary
H01LSemiconductor devices31%
H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h1031%
H10PGeneric processes or apparatus for the manufacture or treatment of devices covered by class h1022%
Y02PClimate change mitigation technologies in the production or processing of goods8%
G01RMeasuring electric variables6%
H10DInorganic electric semiconductor devices3%
PatentTitleYear
12,564,066Semiconductor structure having passive component and method of manufacturing thereof202612,550,798Interposer with built-in wiring for testing an embedded integrated passive device and methods for forming the same202612,512,372Semiconductor structure with testing pads and method of manufacturing thereof202512,469,768Semiconductor package structure and method for forming the same202512,322,742Semiconductor structure and manufacturing method thereof202512,253,558Circuit test structure and method of using202512,125,810Delamination sensor202411,855,066Semiconductor structure and manufacturing method thereof202311,828,790Circuit test structure and method of using202311,616,029Delamination sensor202311,335,672Semiconductor structure and manufacturing method thereof2022Career & activity timeline
Assembled from patent assignee/location history and declaration credentials.
2022–2026Patents assigned to TAIWAN SEMICONDUCTOR MFG CO LTD (11)· patent assignee history
2022–2026Based in TW· patent location history
2024Patents assigned to TAIWAN SEMICONDUTOR MFG COMPANY LTD (1)· patent assignee history
Inventor activity
Assignee and location history derived from the patent record.
Assignees
| Assignee | Patents | Span |
|---|---|---|
| TAIWAN SEMICONDUCTOR MFG CO LTD | 11 | 2022–2026 |
| TAIWAN SEMICONDUTOR MFG COMPANY LTD | 1 | 2024 |
Locations
| Location | Patents | Span |
|---|---|---|
| TW | 11 | 2022–2026 |