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Inventor

Kazuhiko Bandoh

Inventor
Kyoto, JP

Overview

4→
Patents
1998–2007
Patent span
Performing operations
Primary field (CPC B)

Patents· 4 as inventor

Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.

B29Cprimary
B29CShaping or joining of plastics33%
H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h1022%
Y10STechnical subjects covered by former uspc cross-reference art collections [xracs] and digests22%
H10PGeneric processes or apparatus for the manufacture or treatment of devices covered by class h1011%
Y10TTechnical subjects covered by former us classification11%
PatentTitleYear
7,287,975'Resin mold material and resin mold'20076,594,889'Method for processing leadframe'20036,007,316'Apparatus for molding resin to seal electronic parts'19995,750,059'Method of molding resin to seal electronic parts'1998

Career & activity timeline

Assembled from patent assignee/location history and declaration credentials.

1998–2003Patents assigned to TOWA CORP (3)· patent assignee history
1998–2007Based in Kyoto, JP· patent location history
2007Patents assigned to JAPAN FINE CERAMICS CT (1)· patent assignee history

Inventor activity

Assignee and location history derived from the patent record.

Assignees
AssigneePatentsSpan
TOWA CORP31998–2003
JAPAN FINE CERAMICS CT12007
Locations
LocationPatentsSpan
Kyoto, JP41998–2007