Inventor
CHARLES C. GARRETSON
Inventor
US
Overview
Patents· 12 as inventor
Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.
B24Bprimary
B24BMachines, devices, or processes for grinding or polishing38%
H10PGeneric processes or apparatus for the manufacture or treatment of devices covered by class h1022%
H01LSemiconductor devices13%
Y10TTechnical subjects covered by former us classification9%
B25JManipulators6%
G05BControl or regulating systems in general6%
G01BMeasuring length, thickness or similar linear dimensions3%
G06NComputing arrangements based on specific computational models3%
PatentTitleYear
12,551,981Machine learning for classifying retaining rings202612,343,840Control of processing parameters for substrate polishing with substrate precession202512,251,788Polishing head with local wafer pressure202511,986,923Polishing head with local wafer pressure202411,931,853Control of processing parameters for substrate polishing with angularly distributed zones using cost function202411,869,815Asymmetry correction via oriented wafer loading202411,850,703Method of forming retaining ring with shaped surface202311,577,361Retaining ring with shaped surface and method of forming202311,400,560Retaining ring design202211,282,755Asymmetry correction via oriented wafer loading202211,260,500Retaining ring with shaped surface202211,241,769Methods and apparatus for profile and surface preparation of retaining rings utilized in chemical mechanical polishing processes2022Career & activity timeline
Assembled from patent assignee/location history and declaration credentials.
2022–2026Patents assigned to APPLIED MATERIALS INC (12)· patent assignee history
2022–2026Based in US· patent location history
Inventor activity
Assignee and location history derived from the patent record.
Assignees
| Assignee | Patents | Span |
|---|---|---|
| APPLIED MATERIALS INC | 12 | 2022–2026 |
Locations
| Location | Patents | Span |
|---|---|---|
| US | 12 | 2022–2026 |