Inventor

Hing Leung Li

Inventor
Hong Kong, CN

Overview

9→
Patents
1999–2014
Patent span
Performing operations
Primary field (CPC B)

Patents· 9 as inventor

Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.

B23Kprimary
B23KSoldering or unsoldering32%
H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h1032%
B06BMethods or apparatus for generating or transmitting mechanical vibrations of infrasonic, sonic, or ultrasonic frequency, e.g. for performing mechanical work in general18%
H10NElectric solid-state devices not otherwise provided for9%
H01LSemiconductor devices5%
H02NElectric machines not otherwise provided for5%

Career & activity timeline

Assembled from patent assignee/location history and declaration credentials.

1999–2014Based in Yuen Long, HK· patent location history
2003–2005Based in Kowloon, HK· patent location history
2005–2010Patents assigned to ASM ASSEMBLY AUTOMATION LTD (4)· patent assignee history
2006–2014Patents assigned to ASM TECH SINGAPORE PTE LTD (3)· patent assignee history
2006–2011Based in Hong Kong, CN· patent location history
2006–2010Based in Singapore, SG· patent location history
2014Patents assigned to KWAN KA SHING (1)· patent assignee history
2014Patents assigned to LI HING LEUNG (1)· patent assignee history
2014Patents assigned to Li xiang chao (1)· patent assignee history

Inventor activity

Assignee and location history derived from the patent record.

Assignees
AssigneePatentsSpan
ASM ASSEMBLY AUTOMATION LTD42005–2010
ASM TECH SINGAPORE PTE LTD32006–2014
KWAN KA SHING12014
LI HING LEUNGself12014
Li xiang chao12014
Locations
LocationPatentsSpan
Hong Kong, CN32006–2011
Yuen Long, HK21999–2014
Singapore, SG22006–2010
Kowloon, HK22003–2005