Inventor
Takashi Nemoto
Inventor
Tokyo, JP
Overview
Patents· 22 as inventor
Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.
Y10Tprimary
Y10TTechnical subjects covered by former us classification15%
H01LSemiconductor devices9%
H10FInorganic semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation9%
Y02EReduction of greenhouse gas [ghg] emissions, related to energy generation, transmission or distribution9%
F25BRefrigeration machines, plants or systems8%
C08GMacromolecular compounds obtained otherwise than by reactions only involving unsaturated carbon-to-carbon bonds6%
A61NElectrotherapy4%
C08FMacromolecular compounds obtained by reactions only involving carbon-to-carbon unsaturated bonds4%
C08LCompositions of macromolecular compounds4%
C09JAdhesives4%
PatentTitleYear
10,003,003Thermoelectric conversion module20189,842,953'Solar battery rectangular conductor, method for fabricating same and solar battery lead wire'20179,790,405'Photocurable adhesive composition'20179,562,172'Photocurable sheet-type adhesive composition for optical use'20179,530,918'Solar battery rectangular conductor, method for fabricating same and solar battery lead wire'20169,508,883'Rectangular conductor for solar battery, method for fabricating same and lead wire for solar battery'20169,087,962'Thermoelectric conversion module'20158,748,734'Rectangular conductor for solar battery, method for fabricating same and lead wire for solar battery'20148,466,208'Curable sheet composition'20137,992,397'Ammonia/CO2 refrigeration system, CO2 brine production system for use therein, and ammonia cooling unit incorporating that production system'20117,949,406'Low frequency medical device, method therefor, program and recording medium'20117,722,373'Electrical connector with a slidable locking member'20107,695,311'Connector'20107,519,427'Low frequency medical device, method therefor, program and recording medium'20097,425,370'Laminated structural body'20087,406,837'Ammonia/Co2 refrigeration system'20087,377,979'Material coating device'20087,148,426'Lead-free solder, and connection lead and electrical component using said lead-free solder'20066,966,196'Refrigeration unit using ammonia'20056,333,652'Delay circuit'20015,807,394'Surgical instrument'19985,683,091'Spiral wound gasket with at least five inner and outer plies secured by at least four welds'1997Career & activity timeline
Assembled from patent assignee/location history and declaration credentials.
2005–2011Patents assigned to MAEKAWA SEISAKUSHO KK (3)· patent assignee history
2005–2018Based in Tokyo, JP· patent location history
2008–2013Patents assigned to THREE BOND CO LTD (3)· patent assignee history
2009–2011Patents assigned to HIROSE ELECTRIC CO LTD (2)· patent assignee history
2009–2011Patents assigned to ITO CO LTD (2)· patent assignee history
2013Based in Hachioji, JP· patent location history
2014–2017Patents assigned to HITACHI METALS LTD (4)· patent assignee history
2014–2017Based in Hitachi, JP· patent location history
2017Based in Sagamihara, JP· patent location history
2017Based in Kanagawa, JP· patent location history
Inventor activity
Assignee and location history derived from the patent record.
Assignees
| Assignee | Patents | Span |
|---|---|---|
| HITACHI METALS LTD | 4 | 2014–2017 |
| MAEKAWA SEISAKUSHO KK | 3 | 2005–2011 |
| THREE BOND CO LTD | 3 | 2008–2013 |
| HIROSE ELECTRIC CO LTD | 2 | 2009–2011 |
| ITO CO LTD | 2 | 2009–2011 |
Locations
| Location | Patents | Span |
|---|---|---|
| Tokyo, JP | 10 | 2005–2018 |
| Hitachi, JP | 3 | 2014–2017 |
| Sagamihara, JP | 1 | 2017 |
| Kanagawa, JP | 1 | 2017 |
| Hachioji, JP | 1 | 2013 |