Inventor
Ronald L. Imken
Inventor
Round Rock, TX, US
Overview
Patents· 15 as inventor
Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.
H05Kprimary
H05KPrinted circuits33%
H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h1026%
Y10TTechnical subjects covered by former us classification13%
B41JTypewriters5%
G03FPhotomechanical production of textured or patterned surfaces, e.g. for printing, for processing of semiconductor devices5%
H01RElectrically-conductive connections5%
Y10STechnical subjects covered by former uspc cross-reference art collections [xracs] and digests5%
B23KSoldering or unsoldering3%
C08GMacromolecular compounds obtained otherwise than by reactions only involving unsaturated carbon-to-carbon bonds3%
C08LCompositions of macromolecular compounds3%
PatentTitleYear
8,998,384'Circuits and methods using a non-gold corrosion inhibitor'20157,947,429'Long length flexible circuits and method of making same'20117,871,150'Flexible circuits having ink-resistant covercoats'20116,489,042'Photoimageable dielectric material for circuit protection'20026,098,282'Laminar stackable circuit board structure with capacitor'20005,745,333'Laminar stackable circuit board structure with capacitor'19985,509,200'Method of making laminar stackable circuit board structure'19965,363,275'Modular component computer system'19945,316,787'Method for manufacturing electrically isolated polyimide coated vias in a flexible substrate'19945,229,916'Chip edge interconnect overlay element'19935,198,693'Aperture formation in aluminum circuit card for enhanced thermal dissipation'19935,146,674'Manufacturing process of a high density substrate design'19925,065,227'Integrated circuit packaging using flexible substrate'19915,037,311'High density interconnect strip'19914,943,242'Zero insertion force high density connector system'1990Career & activity timeline
Assembled from patent assignee/location history and declaration credentials.
1990–2000Patents assigned to IBM (11)· patent assignee history
1990–2015Based in Round Rock, TX, US· patent location history
2002–2015Patents assigned to 3M INNOVATIVE PROPERTIES CO (4)· patent assignee history
2015Patents assigned to CHAN SOON YENG (1)· patent assignee history
2015Patents assigned to HEWLETT PACKARD DEVELOPMENT CO (1)· patent assignee history
2015Patents assigned to IMKEN RONALD L (1)· patent assignee history
Inventor activity
Assignee and location history derived from the patent record.
Assignees
| Assignee | Patents | Span |
|---|---|---|
| IBM | 11 | 1990–2000 |
| 3M INNOVATIVE PROPERTIES CO | 4 | 2002–2015 |
| CHAN SOON YENG | 1 | 2015 |
| HEWLETT PACKARD DEVELOPMENT CO | 1 | 2015 |
| IMKEN RONALD Lself | 1 | 2015 |
Locations
| Location | Patents | Span |
|---|---|---|
| Round Rock, Texas, US | 15 | 1990–2015 |