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Inventor

Philip William Seitzer

Inventor
Bethlehem, PA, US

Overview

4→
Patents
2006–2007
Patent span
Physics
Primary field (CPC G)

Patents· 4 as inventor

Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.

G01Rprimary
G01RMeasuring electric variables50%
H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h1050%
PatentTitleYear
7,301,231'Reinforced bond pad for a semiconductor device'20077,239,160'Method of electrical testing of an integrated circuit with an electrical probe'20077,132,840'Method of electrical testing'20067,115,985'Reinforced bond pad for a semiconductor device'2006

Career & activity timeline

Assembled from patent assignee/location history and declaration credentials.

2006–2007Patents assigned to AGERE SYSTEMS INC (4)· patent assignee history
2006–2007Based in Bethlehem, PA, US· patent location history

Inventor activity

Assignee and location history derived from the patent record.

Assignees
AssigneePatentsSpan
AGERE SYSTEMS INC42006–2007
Locations
LocationPatentsSpan
Bethlehem, Pennsylvania, US42006–2007