Inventor
Ming-Hsien Chen
Inventor
Hsinchu, TW
Overview
Patents· 18 as inventor
Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.
H10Wprimary
H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h1013%
H02MApparatus for conversion between ac and ac, between ac and dc, or between dc and dc, and for use with mains or similar power supply systems9%
H04LTransmission of digital information, e.g. telegraphic communication9%
Y02BClimate change mitigation technologies related to buildings, e.g. housing, house appliances or related end-user applications9%
H02JElectric power networks6%
H10DInorganic electric semiconductor devices6%
B08BCleaning in general3%
B25CHand-held nailing or stapling tools3%
F24HFluid heaters, e.g. water or air heaters, having heat-generating means, e.g. heat pumps, in general3%
F26BDrying solid materials or objects by removing liquid therefrom3%
PatentTitleYear
11,123,775Apparatus and method for cleaning substrates202110,802,296Optical lens for vision correction202010,608,955Reverse breadth-first search method for optimizing network traffic in a distributed system with a point of convergence202010,333,821Method and system for optimizing network traffic in a distributed system with a point of convergence201910,218,172Integrated uninterruptible power supply201910,157,981Structure and formation method of semiconductor device structure with well regions20189,641,452'Resolving a convex optimization problem to optimize network traffic in a distributed system'20179,300,220'Uninterruptible power supply system'20169,214,854'Total harmonic current distortion control circuit and method thereof'20158,624,628'Adjustable level shifter'20147,772,625'Image sensor having an RPO layer containing nitrogen'20107,763,923'Metal-insulator-metal capacitor structure having low voltage dependence'20107,323,784'Top via pattern for bond pad structure'20086,913,179'Safety device for locking the safety bar of pneumatic nailers'20056,853,803'High-performance water heater'20056,673,652'Underfilling method for a flip-chip packaging process'20046,384,613'Wafer burn-in testing method'20026,194,249'Method of assembly stress protection'2001Career & activity timeline
Assembled from patent assignee/location history and declaration credentials.
2001–2010Patents assigned to TAIWAN SEMICONDUCTOR MFG (4)· patent assignee history
2002–2004Patents assigned to AMIC TECHNOLOGY INC (2)· patent assignee history
2002–2018Based in Hsinchu, TW· patent location history
2005–2021Based in Taichung, TW· patent location history
2014Patents assigned to AGERE SYSTEMS LLC (1)· patent assignee history
2014Based in Shanghai, CN· patent location history
2015–2019Patents assigned to VOLTRONIC POWER TECHNOLOGY CORP (3)· patent assignee history
2015–2020Based in New Taipei, TW· patent location history
2017–2020Patents assigned to VMWARE INC (3)· patent assignee history
2017–2020Based in Beijing, CN· patent location history
Inventor activity
Assignee and location history derived from the patent record.
Assignees
| Assignee | Patents | Span |
|---|---|---|
| TAIWAN SEMICONDUCTOR MFG | 4 | 2001–2010 |
| VMWARE INC | 3 | 2017–2020 |
| VOLTRONIC POWER TECHNOLOGY CORP | 3 | 2015–2019 |
| AMIC TECHNOLOGY INC | 2 | 2002–2004 |
| AGERE SYSTEMS LLC | 1 | 2014 |
Locations
| Location | Patents | Span |
|---|---|---|
| Hsinchu, TW | 5 | 2002–2018 |
| New Taipei, TW | 4 | 2015–2020 |
| Beijing, CN | 3 | 2017–2020 |
| Taichung, TW | 2 | 2005–2021 |
| Shanghai, CN | 1 | 2014 |