Inventor
Abdul Rahman Mohamed
Inventor
Johor, MY
Overview
Patents· 6 as inventor
Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.
H10Wprimary
H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h1050%
H01LSemiconductor devices20%
H10PGeneric processes or apparatus for the manufacture or treatment of devices covered by class h1020%
Y10TTechnical subjects covered by former us classification10%
PatentTitleYear
10,325,838Semiconductor device fabricated by flux-free soldering20199,196,521'Adjustable pick-up head and method for manufacturing a device'20158,975,117'Semiconductor device using diffusion soldering'20158,642,394'Method of manufacturing electronic device on leadframe'20147,863,104'Method of producing a thin semiconductor chip'20117,615,410'Chip-sized flip-chip semiconductor package and method for making the same'2009Career & activity timeline
Assembled from patent assignee/location history and declaration credentials.
2009–2019Patents assigned to INFINEON TECHNOLOGIES AG (6)· patent assignee history
2009–2019Based in Johor, MY· patent location history
2014–2015Patents assigned to MOHAMED ABDUL RAHMAN (2)· patent assignee history
2014–2015Patents assigned to OTREMBA RALF (2)· patent assignee history
2014Patents assigned to DORAISAMY STANLEY JOB (1)· patent assignee history
2015Patents assigned to CHONG CHOOI MEI (1)· patent assignee history
2015Based in Muar, MY· patent location history
Inventor activity
Assignee and location history derived from the patent record.
Assignees
| Assignee | Patents | Span |
|---|---|---|
| INFINEON TECHNOLOGIES AG | 6 | 2009–2019 |
| MOHAMED ABDUL RAHMANself | 2 | 2014–2015 |
| OTREMBA RALF | 2 | 2014–2015 |
| CHONG CHOOI MEI | 1 | 2015 |
| DORAISAMY STANLEY JOB | 1 | 2014 |
Locations
| Location | Patents | Span |
|---|---|---|
| Johor, MY | 5 | 2009–2019 |
| Muar, MY | 1 | 2015 |