Inventor
SON NGUYEN
Inventor
US
Overview
Patents· 25 as inventor
Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.
H01Lprimary
H01LSemiconductor devices20%
H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h1019%
H10PGeneric processes or apparatus for the manufacture or treatment of devices covered by class h1017%
C23CCoating metallic material8%
H10DInorganic electric semiconductor devices6%
LOC106%
A61BDiagnosis3%
H10NElectric solid-state devices not otherwise provided for3%
A61FFilters implantable into blood vessels2%
B05DProcesses for applying fluent materials to surfaces, in general2%
PatentTitleYear
12,588,261Selective deposition on metals using porous low-k materials202612,563,980Selective deposition and cross-linking of polymeric dielectric material202612,557,297Leveling dielectric surfaces for contact formation with embedded memory arrays202612,476,144Etch back and film profile shaping of selective dielectric deposition202512,446,306Stacked field effect transistor structure with independent gate control between top and bottom gates202512,438,039Air gap in beol interconnect202512,419,079Field effect transistor with backside source/drain202512,387,937Sam formulations and cleaning to promote quick depositions2025D1071760Wearable sensor adhesive patch2025D1071759Wearable biological sensor2025D1071761Wearable sensor adhesive patch2025D1070619Wearable sensor adhesive patch2025D1069798Wearable sensor docking station202512,206,325Pumping controller for a plurality of charge pump units202512,102,316Devices and methods of visualizing and determining depth of penetration in cardiac tissue202412,082,813Multi-window guide tunnel202411,942,426Semiconductor structure having alternating selective metal and dielectric layers202411,908,734Composite interconnect formation using graphene202411,791,398Nano multilayer carbon-rich low-k spacer202311,756,786Forming high carbon content flowable dielectric film with low processing damage202311,557,464Semiconductor chamber coatings and processes202311,257,693Methods and systems to improve pedestal temperature control202211,196,695Document manager integration202111,177,167Ultrathin multilayer metal alloy liner for nano Cu interconnects202111,164,776Metallic interconnect structure2021Career & activity timeline
Assembled from patent assignee/location history and declaration credentials.
2021–2026Patents assigned to IBM (14)· patent assignee history
2021Patents assigned to FISH & RICHARDSON P C (1)· patent assignee history
2021–2026Based in US· patent location history
2022–2023Patents assigned to APPLIED MATERIALS INC (2)· patent assignee history
2024Patents assigned to ANCORA HEART INC (2)· patent assignee history
2025Patents assigned to ZYWIE INC (5)· patent assignee history
2025Based in VN· patent location history
Inventor activity
Assignee and location history derived from the patent record.
Assignees
| Assignee | Patents | Span |
|---|---|---|
| IBM | 14 | 2021–2026 |
| ZYWIE INC | 5 | 2025 |
| ANCORA HEART INC | 2 | 2024 |
| APPLIED MATERIALS INC | 2 | 2022–2023 |
| FISH & RICHARDSON P C | 1 | 2021 |
Locations
| Location | Patents | Span |
|---|---|---|
| US | 24 | 2021–2026 |
| VN | 1 | 2025 |