Inventor

Laurent-Luc Chapelon

Inventor

Domene, FR

Overview

20→

Patents

2013–2019

Patent span

Electricity

Primary field (CPC H)

Patents· 20 as inventor

Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.

H10Wprimary

H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h1032%

H01LSemiconductor devices25%

H10PGeneric processes or apparatus for the manufacture or treatment of devices covered by class h1020%

H10DInorganic electric semiconductor devices9%

B81BMicrostructural devices or systems, e.g. micromechanical devices2%

B81CProcesses or apparatus specially adapted for the manufacture or treatment of microstructural devices or systems2%

G01KMeasuring temperature2%

G01PMeasuring linear or angular speed, acceleration, deceleration, or shock2%

H03HImpedance networks, e.g. resonant circuits2%

H10BElectronic memory devices2%

PatentTitleYear

10,403,682Phase-change memory2019 9,520,334'Integrated structure with improved heat dissipation'2016 9,455,239'Integrated circuit chip and fabrication method'2016 9,431,373'Method for estimating the diffusion length of metallic species within a three-dimensional integrated structure, and corresponding three-dimensional integrated structure'2016 9,293,429'Electronic chip comprising connection pillars and manufacturing method'2016 9,136,233'Process for fabricating a three-dimensional integrated structure with improved heat dissipation, and corresponding three-dimensional integrated structure'2015 9,093,456'Stack of semiconductor structures and corresponding manufacturing method'2015 9,093,505'Integrated circuit chip and fabrication method'2015 8,980,738'Integrated circuit chip and fabrication method'2015 8,916,393'Method for estimating the diffusion length of metallic species within a three-dimensional integrated structure, and corresponding three-dimensional integrated structure'2014 8,907,481'Stack of semiconductor structures and corresponding manufacturing method'2014 8,896,121'Chip assembly system'2014 8,890,276'Three-dimensional integrated structure capable of detecting a temperature rise'2014 8,860,186'Method for manufacturing an integrated circuit comprising vias crossing the substrate'2014 8,766,381'Integrated circuit comprising a device with a vertical mobile element integrated in a support substrate and method for producing the device with a mobile element'2014 8,726,736'Method for determining the local stress induced in a semiconductor material wafer by through vias'2014 8,674,517'Method of assembling two integrated circuits and corresponding structure'2014 8,673,740'Method for formation of an electrically conducting through via'2014 8,518,802'Process for fabricating integrated-circuit chips'2013 8,466,038'Process for fabricating integrated-circuit chips'2013

Career & activity timeline

Assembled from patent assignee/location history and declaration credentials.

2013–2016Patents assigned to ST MICROELECTRONICS CROLLES 2 (16)· patent assignee history

2013–2016Patents assigned to CHAPELON LAURENT-LUC (9)· patent assignee history

2013–2015Patents assigned to CUZZOCREA JULIEN (5)· patent assignee history

2013–2019Based in Domene, FR· patent location history

2014–2016Patents assigned to ST MICROELECTRONICS SA (4)· patent assignee history

2016–2019Patents assigned to ST MICROELECTRONICS CROLLES 2 SAS (4)· patent assignee history

Inventor activity

Assignee and location history derived from the patent record.

Assignees

Assignee	Patents	Span
ST MICROELECTRONICS CROLLES 2	16	2013–2016
CHAPELON LAURENT-LUCself	9	2013–2016
CUZZOCREA JULIEN	5	2013–2015
ST MICROELECTRONICS CROLLES 2 SAS	4	2016–2019
ST MICROELECTRONICS SA	4	2014–2016

Locations

Location	Patents	Span
Domene, FR	20	2013–2019