Inventor
Allen F. Horn, III
Inventor
Danielson, CT, US
Overview
Patents· 19 as inventor
Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.
H05Kprimary
H05KPrinted circuits15%
Y10TTechnical subjects covered by former us classification15%
C08KUse of inorganic or non-macromolecular organic substances as compounding ingredients12%
Y10STechnical subjects covered by former uspc cross-reference art collections [xracs] and digests10%
H01BCables7%
C08LCompositions of macromolecular compounds6%
H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h106%
C09DCoating compositions, e.g. paints, varnishes or lacquers3%
B29CShaping or joining of plastics2%
B29KIndexing scheme associated with subclasses b29b, b29c or b29d, relating to moulding materials or to materials for moulds, reinforcements, fillers or preformed parts, e.g. inserts2%
PatentTitleYear
10,947,367Polytetrafluoroethylene hexaferrite composites202110,435,534Dielectric substrate comprising unsintered polytetrafluoroethylene and methods of making the same20199,596,755'Magneto-dielectric substrate, circuit material, and assembly having the same'20178,187,696'Circuit materials, circuits laminates, and method of manufacture thereof'20127,549,220'Method for making a multilayer circuit'20096,994,896'Liquid crystalline polymer composites, method of manufacture thereof, and articles formed therefrom'20066,515,066'Casting mixtures comprising granular and dispersion fluoropolymers'20036,218,015'Casting mixtures comprising granular and dispersion fluoropolymers'20016,198,216'Electroluminescent lamps having improved interfacial adhesion'20015,922,453'Ceramic-filled fluoropolymer composite containing polymeric powder for high frequency circuit substrates'19995,552,210'Ceramic filled composite polymeric electrical substrate material exhibiting high dielectric constant and low thermal coefficient of dielectric constant'19965,384,181'Low volume fraction ceramic filled fluoropolymeric composite material'19955,358,775'Fluoropolymeric electrical substrate material exhibiting low thermal coefficient of dielectric constant'19945,281,466'Low volume fraction ceramic filled fluoropolymeric composite material'19945,198,295'Ceramic filled fluoropolymeric composite material'19935,194,326'Ceramic filled fluoropolymeric composite material'19935,077,115'Thermoplastic composite material'19915,061,548'Ceramic filled fluoropolymeric composite material'19914,987,274'Coaxial cable insulation and coaxial cable made therewith'1991Career & activity timeline
Assembled from patent assignee/location history and declaration credentials.
1991–2021Patents assigned to ROGERS CORP (12)· patent assignee history
1991–2003Based in Danielson, CT, US· patent location history
2001–2012Patents assigned to WORLD PROPERTIES INC (6)· patent assignee history
2006–2021Based in Pomfret Center, CT, US· patent location history
2012Patents assigned to BAARS DIRK M (1)· patent assignee history
2012Patents assigned to CAISSE CHRISTOPHER J (1)· patent assignee history
2019Patents assigned to GARLOCK SEALING TECH LLC (1)· patent assignee history
2019Based in Rogers, CT, US· patent location history
Inventor activity
Assignee and location history derived from the patent record.
Assignees
| Assignee | Patents | Span |
|---|---|---|
| ROGERS CORP | 12 | 1991–2021 |
| WORLD PROPERTIES INC | 6 | 2001–2012 |
| BAARS DIRK M | 1 | 2012 |
| CAISSE CHRISTOPHER J | 1 | 2012 |
| GARLOCK SEALING TECH LLC | 1 | 2019 |
Locations
| Location | Patents | Span |
|---|---|---|
| Danielson, CT, US | 13 | 1991–2003 |
| Pomfret Center, CT, US | 5 | 2006–2021 |
| Rogers, CT, US | 1 | 2019 |