Inventor
Frank L. Hall
Inventor
Boise, ID, US
Overview
Patents· 20 as inventor
Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.
H10Wprimary
H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h1069%
H10FInorganic semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation19%
B33YAdditive manufacturing, i.e. manufacturing of three-dimensional [3d] objects by additive deposition, additive agglomeration or additive layering, e.g. by 3d printing, stereolithography or selective laser sintering8%
E21BEarth or rock drilling4%
PatentTitleYear
8,093,730'Underfilled semiconductor die assemblies and methods of forming the same'20127,993,977'Method of forming molded standoff structures on integrated circuit devices'20117,851,907'Semiconductor integrated circuit package having electrically disconnected solder balls for mounting'20107,642,643'Apparatus for molding a semiconductor die package with enhanced thermal conductivity'20107,498,606'Microelectronic imaging units and methods of manufacturing microelectronic imaging units'20097,485,971'Electronic device package'20097,468,559'Semiconductor integrated circuit package having electrically disconnected solder balls for mounting'20087,417,294'Microelectronic imaging units and methods of manufacturing microelectronic imaging units'20087,416,913'Methods of manufacturing microelectronic imaging units with discrete standoffs'20087,364,934'Microelectronic imaging units and methods of manufacturing microelectronic imaging units'20087,342,319'Semiconductor integrated circuit package having electrically disconnected solder balls for mounting'20087,276,802'Semiconductor integrated circuit package having electrically disconnected solder balls for mounting'20077,268,067'Semiconductor integrated circuit package having electrically disconnected solder balls for mounting'20077,262,074'Methods of fabricating underfilled, encapsulated semiconductor die assemblies'20077,116,000'Underfilled, encapsulated semiconductor die assemblies and methods of fabrication'20067,084,515'Electronic device package'20066,987,058'Methods for underfilling and encapsulating semiconductor device assemblies with a single dielectric material'20066,969,914'Electronic device package'20056,835,592'Methods for molding a semiconductor die package with enhanced thermal conductivity'20045,072,795'Pressure compensator for drill bit lubrication system'1991Career & activity timeline
Assembled from patent assignee/location history and declaration credentials.
1991Patents assigned to CAMCO INT (1)· patent assignee history
1991Based in Houston, TX, US· patent location history
2004–2012Patents assigned to MICRON TECHNOLOGY INC (19)· patent assignee history
2004–2012Based in Boise, ID, US· patent location history
2012Patents assigned to BAERLOCHER CARY J (1)· patent assignee history
2012Patents assigned to HALL FRANK L (1)· patent assignee history
Inventor activity
Assignee and location history derived from the patent record.
Assignees
| Assignee | Patents | Span |
|---|---|---|
| MICRON TECHNOLOGY INC | 19 | 2004–2012 |
| BAERLOCHER CARY J | 1 | 2012 |
| CAMCO INT | 1 | 1991 |
| HALL FRANK Lself | 1 | 2012 |
Locations
| Location | Patents | Span |
|---|---|---|
| Boise, ID, US | 19 | 2004–2012 |
| Houston, Texas, US | 1 | 1991 |