Inventor

JAMES W. STASIAK

Inventor
US

Overview

3→
Patents
2024
Patent span
Performing operations
Primary field (CPC B)

Patents· 3 as inventor

Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.

B29Cprimary
B29CShaping or joining of plastics14%
B29KIndexing scheme associated with subclasses b29b, b29c or b29d, relating to moulding materials or to materials for moulds, reinforcements, fillers or preformed parts, e.g. inserts14%
B33YAdditive manufacturing, i.e. manufacturing of three-dimensional [3d] objects by additive deposition, additive agglomeration or additive layering, e.g. by 3d printing, stereolithography or selective laser sintering14%
C08LCompositions of macromolecular compounds14%
B22FWorking metallic powder10%
C08KUse of inorganic or non-macromolecular organic substances as compounding ingredients10%
Y02PClimate change mitigation technologies in the production or processing of goods10%
C08FMacromolecular compounds obtained by reactions only involving carbon-to-carbon unsaturated bonds5%
C08GMacromolecular compounds obtained otherwise than by reactions only involving unsaturated carbon-to-carbon bonds5%
C09DCoating compositions, e.g. paints, varnishes or lacquers5%

Career & activity timeline

Assembled from patent assignee/location history and declaration credentials.

2024Patents assigned to HEWLETT PACKARD DEVELOPMENT CO (3)· patent assignee history
2024Based in US· patent location history

Inventor activity

Assignee and location history derived from the patent record.

Assignees
AssigneePatentsSpan
HEWLETT PACKARD DEVELOPMENT CO32024
Locations
LocationPatentsSpan
US32024