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Inventor

Yuzo Shimobeppu

Inventor
Kawasaki, JP

Overview

19→
Patents
2002–2015
Patent span
Electricity
Primary field (CPC H)

Patents· 19 as inventor

Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.

H10Pprimary
H10PGeneric processes or apparatus for the manufacture or treatment of devices covered by class h1029%
H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h1019%
Y10TTechnical subjects covered by former us classification14%
B24BMachines, devices, or processes for grinding or polishing12%
B32BLayered products, i.e. products built-up of strata of flat or non-flat, e.g. cellular or honeycomb, form12%
B29CShaping or joining of plastics3%
H10FInorganic semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation3%
B23KSoldering or unsoldering2%
B65DContainers for storage or transport of articles or materials, e.g. bags, barrels, bottles, boxes, cans, cartons, crates, drums, jars, tanks, hoppers, forwarding containers2%
H01LSemiconductor devices2%
PatentTitleYear
9,010,615'Bonding apparatus and bonding method'20158,444,799'Method for manufacturing semiconductor device and surface protective tape'20138,440,545'Method of manufacturing semiconductor device with spraying fluid'20138,016,973'Film bonding method, film bonding apparatus, and semiconductor device manufacturing method'20117,857,140'Semiconductor wafer storage case and semiconductor wafer storing method'20107,820,487'Manufacturing method of semiconductor device'20107,655,505'Manufacturing method of semiconductor device'20107,571,538'Vacuum fixing jig for semiconductor device'20097,563,343'Film lamination apparatus and method and a manufacturing method of a semiconductor apparatus'20097,479,627'Semiconductor device having transparent member and manufacturing method of the same'20097,432,114'Semiconductor device manufacturing method'20087,395,847'Jig for a semiconductor substrate'20087,109,561'Method of manufacturing a semiconductor device and a method for fixing the semiconductor device using substrate jig'20066,951,800'Method of making semiconductor device that has improved structural strength'20056,902,944'Method of manufacturing a semiconductor device and a method for fixing the semiconductor device using substrate jig'20056,837,776'Flat-object holder and method of using the same'20056,750,074'Method of manufacturing a semiconductor device and a method for fixing the semiconductor device using substrate jig'20046,673,654'Method of manufacturing semiconductor device using heated conveyance member'20046,461,942'Semiconductor chip removing and conveying method and device'2002

Career & activity timeline

Assembled from patent assignee/location history and declaration credentials.

2002–2008Patents assigned to FUJITSU LTD (9)· patent assignee history
2002–2015Based in Kawasaki, JP· patent location history
2005Based in Kanagawa, JP· patent location history
2009–2010Patents assigned to FUJITSU MICROELECTRONICS LTD (4)· patent assignee history
2010–2015Patents assigned to FUJITSU SEMICONDUCTOR LTD (6)· patent assignee history
2013Patents assigned to FUKAYA HIRONORI (2)· patent assignee history
2013Patents assigned to SAKAMOTO MIKA (2)· patent assignee history
2013Based in Yokohama, JP· patent location history

Inventor activity

Assignee and location history derived from the patent record.

Assignees
AssigneePatentsSpan
FUJITSU LTD92002–2008
FUJITSU SEMICONDUCTOR LTD62010–2015
FUJITSU MICROELECTRONICS LTD42009–2010
FUKAYA HIRONORI22013
SAKAMOTO MIKA22013
Locations
LocationPatentsSpan
Kawasaki, JP172002–2015
Yokohama, JP12013
Kanagawa, JP12005