Inventor
Seung Do An
Inventor
Suwon-si, KR
Overview
Patents· 16 as inventor
Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.
G02Bprimary
G02BOptical elements, systems or apparatus23%
B81BMicrostructural devices or systems, e.g. micromechanical devices14%
B81CProcesses or apparatus specially adapted for the manufacture or treatment of microstructural devices or systems14%
H10NElectric solid-state devices not otherwise provided for9%
G01CMeasuring distances, levels or bearings5%
G01PMeasuring linear or angular speed, acceleration, deceleration, or shock5%
H10DInorganic electric semiconductor devices5%
Y10STechnical subjects covered by former uspc cross-reference art collections [xracs] and digests5%
Y10TTechnical subjects covered by former us classification5%
B06BMethods or apparatus for generating or transmitting mechanical vibrations of infrasonic, sonic, or ultrasonic frequency, e.g. for performing mechanical work in general2%
PatentTitleYear
11,018,418Chip antenna and chip antenna module including the same20218,686,595'TPMS transmission module having power saving function'20148,558,813'Haptic feedback actuator, haptic feedback device and electronic device'20137,626,745'Diffractive thin-film piezoelectric micromirror and method of producing the same'20097,569,973'Method for driving piezoelectric element or optical modulator including piezoelectric element'20097,569,805'Apparatus and method for calibrating a reflecting mirror'20097,532,319'Apparatus for calibrating displacement of reflective parts in diffractive optical modulator'20097,522,331'Spatial optic modulating system with speckle reduction and method thereof'20097,468,825'Spatial optical modulator with passivation layer'20087,446,922'Interdigitating diffractive light modulator'20087,415,172'Diffractive waveguide-spatial optical modulator'20087,209,290'Diffractive thin-film piezoelectric micromirror and method of producing the same'20077,209,276'Fishbone diffraction-type light modulator'20077,098,535'Semiconductor package and packaging method using flip-chip bonding technology'20066,835,588'Micro inertia sensor and method of manufacturing the same'20046,789,423'Micro inertia sensor and method of manufacturing the same'2004Career & activity timeline
Assembled from patent assignee/location history and declaration credentials.
2004–2021Patents assigned to SAMSUNG ELECTRO MECH (16)· patent assignee history
2004–2021Based in Suwon-si, KR· patent location history
2006–2014Based in Kyungki-do, KR· patent location history
2007–2009Based in Gyeonggi-do, KR· patent location history
2013–2014Patents assigned to AN SEUNG DO (2)· patent assignee history
2013–2014Patents assigned to HAN JONG WOO (2)· patent assignee history
2013–2014Patents assigned to HYUN HAE SEUNG (2)· patent assignee history
2013–2014Patents assigned to SONG JONG HYEONG (2)· patent assignee history
Inventor activity
Assignee and location history derived from the patent record.
Assignees
| Assignee | Patents | Span |
|---|---|---|
| SAMSUNG ELECTRO MECH | 16 | 2004–2021 |
| AN SEUNG DOself | 2 | 2013–2014 |
| HAN JONG WOO | 2 | 2013–2014 |
| HYUN HAE SEUNG | 2 | 2013–2014 |
| SONG JONG HYEONG | 2 | 2013–2014 |
Locations
| Location | Patents | Span |
|---|---|---|
| Suwon-si, KR | 8 | 2004–2021 |
| Kyungki-do, KR | 6 | 2006–2014 |
| Gyeonggi-do, KR | 2 | 2007–2009 |