LexDanaLexDanabeta
Inventor

Sebastian T. M. Soon

Inventor
Singapore, SG

Overview

3→
Patents
2005–2011
Patent span
Electricity
Primary field (CPC H)

Patents· 3 as inventor

Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.

H10Wprimary
H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h10100%
PatentTitleYear
7,928,564'Multichip module package and fabrication method'20117,445,955'Multichip module package and fabrication method'20086,943,057'Multichip module package and fabrication method'2005

Career & activity timeline

Assembled from patent assignee/location history and declaration credentials.

2005–2011Patents assigned to STATS CHIPPAC LTD (3)· patent assignee history
2005–2011Based in Singapore, SG· patent location history

Inventor activity

Assignee and location history derived from the patent record.

Assignees
AssigneePatentsSpan
STATS CHIPPAC LTD32005–2011
Locations
LocationPatentsSpan
Singapore, SG32005–2011