Inventor
Jordi Teva
Inventor
Veldhoven, NL
Overview
Patents· 13 as inventor
Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.
H01Lprimary
H01LSemiconductor devices33%
H10FInorganic semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation22%
H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h1017%
Y02EReduction of greenhouse gas [ghg] emissions, related to energy generation, transmission or distribution17%
G02BOptical elements, systems or apparatus3%
G03FPhotomechanical production of textured or patterned surfaces, e.g. for printing, for processing of semiconductor devices3%
H05KPrinted circuits3%
H10PGeneric processes or apparatus for the manufacture or treatment of devices covered by class h103%
PatentTitleYear
10,522,696Lateral single-photon avalanche diode and method of producing a lateral single-photon avalanche diode201910,374,114Lateral single-photon avalanche diode and method of producing a lateral single-photon avalanche diode201910,128,385Lateral single-photon avalanche diode and method of producing a lateral single photon avalanche diode20189,995,894Semiconductor device with optical and electrical vias20189,466,529'Masking method for semiconductor devices with high surface topography'20169,443,759'Method for producing a semiconductor device comprising a conductor layer in the semiconductor body and semiconductor body'20169,293,626'Lateral avalanche photodiode device and method of production'20169,252,298'Photodiode device with reducible space charge region'20169,245,843'Semiconductor device with internal substrate contact and method of production'20169,054,261'Photodiode device and method for production thereof'20159,018,726'Photodiode and production method'20158,884,442'Method for producing a semiconductor component with a through-contact and semiconductor component with through-contact'20148,633,107'Method of producing a semiconductor device and semiconductor device having a through-wafer interconnect'2014Career & activity timeline
Assembled from patent assignee/location history and declaration credentials.
2014–2019Patents assigned to AMS AG (13)· patent assignee history
2014–2016Patents assigned to TEVA JORDI (5)· patent assignee history
2014–2016Patents assigned to KRAFT JOCHEN (4)· patent assignee history
2014–2016Patents assigned to KOPPITSCH GÜNTHER (2)· patent assignee history
2014–2015Based in Graz, AT· patent location history
2015–2016Patents assigned to MINIXHOFER RAINER (2)· patent assignee history
2015–2016Based in Eindhoven, NL· patent location history
2016–2019Based in Veldhoven, NL· patent location history
Inventor activity
Assignee and location history derived from the patent record.
Assignees
| Assignee | Patents | Span |
|---|---|---|
| AMS AG | 13 | 2014–2019 |
| TEVA JORDIself | 5 | 2014–2016 |
| KRAFT JOCHEN | 4 | 2014–2016 |
| KOPPITSCH GÜNTHER | 2 | 2014–2016 |
| MINIXHOFER RAINER | 2 | 2015–2016 |
Locations
| Location | Patents | Span |
|---|---|---|
| Veldhoven, NL | 6 | 2016–2019 |
| Eindhoven, NL | 4 | 2015–2016 |
| Graz, AT | 3 | 2014–2015 |