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Inventor

ABDOLREZA LANGARI

Inventor
US

Overview

3→
Patents
2022–2025
Patent span
Electricity
Primary field (CPC H)

Patents· 3 as inventor

Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.

H01Lprimary
H01LSemiconductor devices50%
H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h1050%
PatentTitleYear
12,300,655Integrated circuit assembly with hybrid bonding202511,670,614Integrated circuit assembly with hybrid bonding202311,437,307Device comprising first solder interconnects aligned in a first direction and second solder interconnects aligned in a second direction2022

Career & activity timeline

Assembled from patent assignee/location history and declaration credentials.

2022–2025Patents assigned to QUALCOMM INC (3)· patent assignee history
2022–2025Based in US· patent location history

Inventor activity

Assignee and location history derived from the patent record.

Assignees
AssigneePatentsSpan
QUALCOMM INC32022–2025
Locations
LocationPatentsSpan
US32022–2025