Inventor
Ven R. Holalkere
Inventor
Dublin, CA, US
Overview
Patents· 7 as inventor
Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.
H05Kprimary
H05KPrinted circuits29%
F28FDetails of heat-exchange and heat-transfer apparatus, of general application14%
G06FElectric digital data processing14%
H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h1014%
B82YSpecific uses or applications of nanostructures7%
F28DHeat-exchange apparatus, not provided for in another subclass, in which the heat-exchange media do not come into direct contact7%
H01RElectrically-conductive connections7%
Y10STechnical subjects covered by former uspc cross-reference art collections [xracs] and digests7%
PatentTitleYear
7,402,048'Technique for blind-mating daughtercard to mainboard'20087,115,987'Integrated stacked microchannel heat exchanger and heat spreader'20067,079,388'Baffles for high capacity air-cooling systems for electronics apparatus'20066,965,513'Carbon nanotube thermal interface structures'20056,836,407'Computer system having a plurality of server units transferring heat to a fluid flowing through a frame-level fluid-channeling structure'20046,813,149'High capacity air-cooling systems for electronic apparatus and associated methods'20046,741,465'Cooling method and apparatus for handheld devices'2004Career & activity timeline
Assembled from patent assignee/location history and declaration credentials.
2004–2008Patents assigned to INTEL CORP (7)· patent assignee history
2004–2006Based in Dublin, CA, US· patent location history
2008Based in Lakewood, WA, US· patent location history
Inventor activity
Assignee and location history derived from the patent record.
Assignees
| Assignee | Patents | Span |
|---|---|---|
| INTEL CORP | 7 | 2004–2008 |
Locations
| Location | Patents | Span |
|---|---|---|
| Dublin, California, US | 6 | 2004–2006 |
| Lakewood, Washington, US | 1 | 2008 |