Inventor
Robert Sankman
Inventor
Phoenix, AZ, US
Overview
Patents· 6 as inventor
Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.
H10Wprimary
H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h1028%
H01LSemiconductor devices22%
H03KPulse technique11%
B81BMicrostructural devices or systems, e.g. micromechanical devices6%
B81CProcesses or apparatus specially adapted for the manufacture or treatment of microstructural devices or systems6%
F28FDetails of heat-exchange and heat-transfer apparatus, of general application6%
G01PMeasuring linear or angular speed, acceleration, deceleration, or shock6%
G06FElectric digital data processing6%
H01HElectric switches6%
H05KPrinted circuits6%
PatentTitleYear
11,070,209Programmable logic device with fine-grained disaggregation202110,765,046Electromagnetic interference shields for electronic packages and related methods202010,601,426Programmable logic device with fine-grained disaggregation20209,162,867'Through-silicon via resonators in chip packages and methods of assembling same'20157,212,405'Method and apparatus for providing distributed fluid flows in a thermal management arrangement'20076,493,223'Computer utilizing refrigeration for cooling'2002Career & activity timeline
Assembled from patent assignee/location history and declaration credentials.
2002–2021Patents assigned to INTEL CORP (6)· patent assignee history
2002–2021Based in Phoenix, AZ, US· patent location history
2015Patents assigned to SANKMAN ROBERT BOB L (1)· patent assignee history
2015Patents assigned to TEH WENG HONG (1)· patent assignee history
Inventor activity
Assignee and location history derived from the patent record.
Assignees
| Assignee | Patents | Span |
|---|---|---|
| INTEL CORP | 6 | 2002–2021 |
| SANKMAN ROBERT BOB Lself | 1 | 2015 |
| TEH WENG HONG | 1 | 2015 |
Locations
| Location | Patents | Span |
|---|---|---|
| Phoenix, AZ, US | 6 | 2002–2021 |