Inventor
Ming Yi Yeh
Inventor
New Taipei, TW
Overview
Patents· 3 as inventor
Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.
H05Kprimary
H05KPrinted circuits33%
Y10TTechnical subjects covered by former us classification22%
H01LSemiconductor devices11%
H10HInorganic light-emitting semiconductor devices having potential barriers11%
H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h1011%
Y02PClimate change mitigation technologies in the production or processing of goods11%
PatentTitleYear
9,974,186Method of manufacturing printed circuit board with embedded electronic components positioned by using solder paste20189,443,743'Method for directly attaching dielectric to circuit board with embedded electronic devices'20168,551,812'Manufacturing method of rigid and flexible composite printed circuit board'2013Career & activity timeline
Assembled from patent assignee/location history and declaration credentials.
2013–2018Patents assigned to UNITECH PRINTED CIRCUIT BOARD CORP (3)· patent assignee history
2013Patents assigned to Liu jia lin (1)· patent assignee history
2013Patents assigned to WU CHUNG SHIH (1)· patent assignee history
2013Patents assigned to YEH MING YI (1)· patent assignee history
2013–2018Based in New Taipei, TW· patent location history
Inventor activity
Assignee and location history derived from the patent record.
Assignees
| Assignee | Patents | Span |
|---|---|---|
| UNITECH PRINTED CIRCUIT BOARD CORP | 3 | 2013–2018 |
| Liu jia lin | 1 | 2013 |
| WU CHUNG SHIH | 1 | 2013 |
| YEH MING YIself | 1 | 2013 |
Locations
| Location | Patents | Span |
|---|---|---|
| New Taipei, TW | 3 | 2013–2018 |