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Inventor

CHIEN-HSIANG HUANG

Inventor
TW

Overview

3→
Patents
2022–2025
Patent span
Physics
Primary field (CPC G)

Patents· 3 as inventor

Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.

G01Nprimary
G01NInvestigating or analysing materials by determining their chemical or physical properties33%
G06TImage data processing or generation, in general33%
H01LSemiconductor devices17%
H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h1017%
PatentTitleYear
12,243,218Method and system for scanning wafer202511,783,469Method and system for scanning wafer202311,264,352Electronic package structure with a core ground wire and chip thereof2022

Career & activity timeline

Assembled from patent assignee/location history and declaration credentials.

2022Patents assigned to REALTEK SEMICONDUCTOR CORP (1)· patent assignee history
2022–2025Based in TW· patent location history
2023–2025Patents assigned to TAIWAN SEMICONDUCTOR MFG CO LTD (2)· patent assignee history

Inventor activity

Assignee and location history derived from the patent record.

Assignees
AssigneePatentsSpan
TAIWAN SEMICONDUCTOR MFG CO LTD22023–2025
REALTEK SEMICONDUCTOR CORP12022
Locations
LocationPatentsSpan
TW32022–2025