Inventor
DURODAMI LISK
Inventor
US
Overview
Patents· 4 as inventor
Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.
H01Lprimary
H01LSemiconductor devices40%
H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h1040%
H05KPrinted circuits20%
PatentTitleYear
12,512,401Integrated device substrate including embedded electromagnetic isolation structure202512,243,855Package comprising channel interconnects located between solder interconnects202512,062,648Multiple (multi-) die integrated circuit (IC) packages for supporting higher connection density, and related fabrication methods202411,817,406Semiconductor die employing repurposed seed layer for forming additional signal paths to back end-of-line (BEOL) structure, and related integrated circuit (IC) packages and fabrication methods2023Career & activity timeline
Assembled from patent assignee/location history and declaration credentials.
2023–2025Patents assigned to QUALCOMM INC (4)· patent assignee history
2023–2025Based in US· patent location history
Inventor activity
Assignee and location history derived from the patent record.
Assignees
| Assignee | Patents | Span |
|---|---|---|
| QUALCOMM INC | 4 | 2023–2025 |
Locations
| Location | Patents | Span |
|---|---|---|
| US | 4 | 2023–2025 |